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BZ11 User Manual ​

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Alinx Electronic Limited

Company Website: www.en.alinx.com

Service Hotline: +86 21 67676997

Technical Support: technical@alinx.com


Document Information ​

ItemContent
Document Name User Manual
Product Model BZ11
Document Version V1.0
Prepared by Alinx Electronic Limited
Release Date 2026.11.9

Document Revision History ​

VersionDateSectionRevision Summary
V1.02026.11.9AllInitial Release

Overview ​

Alinx Electronic Limited has officially released the 2025 model of its development board (Model: BZ11) based on the Xilinx Zynq UltraScale+ MPSoC development platform. To help you quickly understand this development platform, we have prepared this user manual.

This MPSoC development platform adopts the Xilinx Zynq UltraScale+ MPSoCs series chip, model XCZU11EG-2FFVC1156I, as its main chip. The ZU11EG chip can be divided into a Processor System (PS) and a Programmable Logic (PL). In addition, the PS side of the FPGA on the development board carries four high-speed DDR4 SDRAM chips with a total of 4GB, one 32GB eMMC storage chip and two 256Mbit QSPI FLASH chips. In the carrier board design we have expanded abundant peripheral interfaces for users, such as 4 FMC HPC connectors, one M.2 SSD interface, one mini_DP interface, one USB3.0 Type-C interface, one Gigabit Ethernet interface, one UART interface, one QSFP+ fiber optic interface and one TF card interface. This development board can meet the requirements of high-speed data exchange, data storage and video transmission processing. It is suitable for AI, edge computing, deep learning, data centers, medical imaging, multimedia, 4K video images, digital signal processing, machine vision, 5G wireless, aerospace radar and satellites, automotive ADAS, in-vehicle simulation and testing, semiconductor simulation and design, and industrial IoT.

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Figure 1.1 - BZ11 Development Board

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Figure 1.2 - BZ11 Computing Box

The following figure shows the structure of the entire development system:

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Figure 1.3 - Development System Structure Diagram

From this figure, we can see the interfaces and functions provided by this development platform.

  • ZU11EG: composed of ZU11EG + 4GB DDR4 (PS) + 32GB eMMC FLASH + 64MB QSPI FLASH.

  • M.2 Interface: one standard PCIe Gen2 x1 M.2 interface for connecting M.2 SSDs, with a single-lane communication speed of up to 5Gbps.

  • DP Output Interface: one standard DisplayPort output interface for video image display, supporting up to 4K@30Hz or 1080P@60Hz output.

  • USB 3.0 Interface: one USB 3.0 interface with a Type-C connector, supporting HOST, SLAVE and OTG modes.

  • Gigabit Ethernet Interface: one 10/100/1000 Mbps Ethernet RJ45 interface on the PS side for Ethernet data exchange with a PC or other network devices.

  • QSFP+ Fiber Optic Interface: four high-speed GTH transceivers of the FPGA are connected to one QSFP+ optical module interface to implement a QSFP+ fiber optic communication interface, with fiber data transmission and reception speeds of up to 40Gbps.

  • Micro SD Card Socket: one Micro SD card socket for storing the operating system image and file system.

  • FMC Expansion Connectors: four standard FMC HPC expansion connectors, which can be connected to various FMC modules from Xilinx or ALINX (HDMI input/output module, GMSL video capture module, GMSL video injection module, etc.).

  • JTAG Debug Port: one 10-pin 2.54mm standard JTAG interface for FPGA program download and debugging; users can debug and download the ZU11EG system with a Xilinx downloader.

  • EEPROM: one EEPROM 24LC04 with an I2C interface.

  • LEDs: four light-emitting diodes (LEDs) and one dual-layer LED. The board has one power indicator, one DONE configuration indicator and two user indicators; the dual-layer LED is connected to the PS side.

  • Push Button: one side-mounted reset button.

Zynq Chip ​

The development board uses the Xilinx Zynq UltraScale+ MPSoC series chip, model XCZU11EG-2FFVC1156I. The PS of the ZU11EG integrates a quad-core ARM Cortex-A53 processor running at up to 1.3GHz with L2 cache support; the ZU11EG also includes a dual-core Cortex-R5 processor running at up to 533MHz.

The ZU11EG supports 32-bit or 64-bit DDR4, LPDDR4, DDR3, DDR3L and LPDDR3 memory chips, and provides rich high-speed interfaces on the PS side such as PCIe Gen2, USB 3.0, SATA 3.1 and DisplayPort, as well as USB 2.0, Gigabit Ethernet, SD/SDIO, I2C, CAN, UART and GPIO. The PL contains abundant programmable logic cells, DSP slices and internal RAM. The overall block diagram of the ZU11EG chip is shown in Figure 2.1.

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Figure 2.1 - ZYNQ ZU11EG Chip Overall Block Diagram

The main parameters of the PS are as follows:

  • ARM quad-core Cortex-A53 processor at up to 1.3GHz, with 32KB L1 instruction and data cache per CPU and a 1MB L2 cache shared by the two CPUs.

  • ARM dual-core Cortex-R5 processor at up to 533MHz, with 32KB L1 instruction and data cache per CPU and 128KB tightly coupled memory.

  • Mali-400 MP2 image/video processor at up to 677MHz with 64KB L2 cache.

  • External memory interface, supporting 32/64-bit DDR4/3/3L, LPDDR4/3, etc.

  • Static memory interface, supporting NAND and 2x Quad-SPI FLASH.

  • High-speed connectivity: PCIe Gen2 x4, 2x USB3.0, SATA 3.1, DisplayPort and 4x Tri-mode Gigabit Ethernet.

  • General connectivity: 2x USB2.0, 2x SD/SDIO, 2x UART, 2x CAN 2.0B, 2x I2C, 2x SPI and 4x 32b GPIO.

  • Power management: supports the Full, Low, PL and Battery power domains.

  • Encryption: supports RSA, AES and SHA.

  • System monitor: 10-bit 1Mbps AD sampling for temperature and voltage monitoring.

The main parameters of the PL are as follows:

  • System Logic Cells: 653.1K;

  • CLB flip-flops: 597.12K;

  • CLB LUTs: 298.56K;

  • Block RAM: 21.1Mb;

  • Clock Management Tiles (CMTs): 8

  • DSP Slices: 2928

  • GTH 16.3Gb/s transceivers: 20

  • The speed grade of the XCZU11EG-2FFVC1156I chip is -2, industrial grade, in an FFVC1156 package.

DDR4 ​

The BZ11 board is equipped with four 1GB Micron DDR4 chips, model MT40A512M16LY-062E. Four DDR4 chips are mounted on the PS side, forming a 64-bit data bus width and 4GB capacity. The PS-side DDR4 SDRAM runs at up to 1200MHz (2400Mbps data rate), and the four DDR4 memory chips are connected directly to the memory interface of PS BANK504. The specific configuration of the PS-side DDR4 SDRAM is shown in Table 3.1.

PositionRef. DesignatorPart NumberCapacityManufacturer
PS U4、U5、U6、U7 MT40A512M16LY-062E 512M x 16bit Micron

Table 3.1 - DDR4 SDRAM Configuration

DDR4 hardware design requires strict consideration of signal integrity. We have fully considered matching resistors, termination resistors, trace impedance control and trace length matching in the circuit and PCB design to ensure stable high-speed operation of DDR4.

The hardware connection of the PS-side DDR4 is shown in Figure 3.1:

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Figure 3.1 - PS-Side DDR4 DRAM Schematic

PS-Side DDR4 SDRAM Pin Assignment:

Signal NamePin NamePin Number
PS_DDR4_DQS0_N PS_DDR_DQS_N0_504 AN27
PS_DDR4_DQS0_P PS_DDR_DQS_P0_504 AN26
PS_DDR4_DQS1_N PS_DDR_DQS_N1_504 AP30
PS_DDR4_DQS1_P PS_DDR_DQS_P1_504 AN29
PS_DDR4_DQS2_N PS_DDR_DQS_N2_504 AJ26
PS_DDR4_DQS2_P PS_DDR_DQS_P2_504 AH26
PS_DDR4_DQS3_N PS_DDR_DQS_N3_504 AK29
PS_DDR4_DQS3_P PS_DDR_DQS_P3_504 AK28
PS_DDR4_DQS4_N PS_DDR_DQS_N4_504 AD31
PS_DDR4_DQS4_P PS_DDR_DQS_P4_504 AD30
PS_DDR4_DQS5_N PS_DDR_DQS_N5_504 Y28
PS_DDR4_DQS5_P PS_DDR_DQS_P5_504 Y27
PS_DDR4_DQS6_N PS_DDR_DQS_N6_504 AB34
PS_DDR4_DQS6_P PS_DDR_DQS_P6_504 AB33
PS_DDR4_DQS7_N PS_DDR_DQS_N7_504 W32
PS_DDR4_DQS7_P PS_DDR_DQS_P7_504 W31
PS_DDR4_DQ0 PS_DDR_DQ0_504 AP27
PS_DDR4_DQ1 PS_DDR_DQ1_504 AP25
PS_DDR4_DQ2 PS_DDR_DQ2_504 AP26
PS_DDR4_DQ3 PS_DDR_DQ3_504 AM26
PS_DDR4_DQ4 PS_DDR_DQ4_504 AP24
PS_DDR4_DQ5 PS_DDR_DQ5_504 AL25
PS_DDR4_DQ6 PS_DDR_DQ6_504 AM25
PS_DDR4_DQ7 PS_DDR_DQ7_504 AM24
PS_DDR4_DQ8 PS_DDR_DQ8_504 AM28
PS_DDR4_DQ9 PS_DDR_DQ9_504 AN28
PS_DDR4_DQ10 PS_DDR_DQ10_504 AP29
PS_DDR4_DQ11 PS_DDR_DQ11_504 AP28
PS_DDR4_DQ12 PS_DDR_DQ12_504 AM31
PS_DDR4_DQ13 PS_DDR_DQ13_504 AP31
PS_DDR4_DQ14 PS_DDR_DQ14_504 AN31
PS_DDR4_DQ15 PS_DDR_DQ15_504 AM30
PS_DDR4_DQ16 PS_DDR_DQ16_504 AF25
PS_DDR4_DQ17 PS_DDR_DQ17_504 AG25
PS_DDR4_DQ18 PS_DDR_DQ18_504 AG26
PS_DDR4_DQ19 PS_DDR_DQ19_504 AJ25
PS_DDR4_DQ20 PS_DDR_DQ20_504 AG24
PS_DDR4_DQ21 PS_DDR_DQ21_504 AK25
PS_DDR4_DQ22 PS_DDR_DQ22_504 AJ24
PS_DDR4_DQ23 PS_DDR_DQ23_504 AK24
PS_DDR4_DQ24 PS_DDR_DQ24_504 AH28
PS_DDR4_DQ25 PS_DDR_DQ25_504 AH27
PS_DDR4_DQ26 PS_DDR_DQ26_504 AJ27
PS_DDR4_DQ27 PS_DDR_DQ27_504 AK27
PS_DDR4_DQ28 PS_DDR_DQ28_504 AL26
PS_DDR4_DQ29 PS_DDR_DQ29_504 AL27
PS_DDR4_DQ30 PS_DDR_DQ30_504 AH29
PS_DDR4_DQ31 PS_DDR_DQ31_504 AL28
PS_DDR4_DQ32 PS_DDR_DQ32_504 AB29
PS_DDR4_DQ33 PS_DDR_DQ33_504 AB30
PS_DDR4_DQ34 PS_DDR_DQ34_504 AC29
PS_DDR4_DQ35 PS_DDR_DQ35_504 AD32
PS_DDR4_DQ36 PS_DDR_DQ36_504 AC31
PS_DDR4_DQ37 PS_DDR_DQ37_504 AE30
PS_DDR4_DQ38 PS_DDR_DQ38_504 AC28
PS_DDR4_DQ39 PS_DDR_DQ39_504 AE29
PS_DDR4_DQ40 PS_DDR_DQ40_504 AC27
PS_DDR4_DQ41 PS_DDR_DQ41_504 AA27
PS_DDR4_DQ42 PS_DDR_DQ42_504 AA28
PS_DDR4_DQ43 PS_DDR_DQ43_504 AB28
PS_DDR4_DQ44 PS_DDR_DQ44_504 W27
PS_DDR4_DQ45 PS_DDR_DQ45_504 W29
PS_DDR4_DQ46 PS_DDR_DQ46_504 W28
PS_DDR4_DQ47 PS_DDR_DQ47_504 V27
PS_DDR4_DQ48 PS_DDR_DQ48_504 AA32
PS_DDR4_DQ49 PS_DDR_DQ49_504 AA33
PS_DDR4_DQ50 PS_DDR_DQ50_504 AA34
PS_DDR4_DQ51 PS_DDR_DQ51_504 AE34
PS_DDR4_DQ52 PS_DDR_DQ52_504 AD34
PS_DDR4_DQ53 PS_DDR_DQ53_504 AB31
PS_DDR4_DQ54 PS_DDR_DQ54_504 AC34
PS_DDR4_DQ55 PS_DDR_DQ55_504 AC33
PS_DDR4_DQ56 PS_DDR_DQ56_504 AA30
PS_DDR4_DQ57 PS_DDR_DQ57_504 Y30
PS_DDR4_DQ58 PS_DDR_DQ58_504 AA31
PS_DDR4_DQ59 PS_DDR_DQ59_504 W30
PS_DDR4_DQ60 PS_DDR_DQ60_504 Y33
PS_DDR4_DQ61 PS_DDR_DQ61_504 W33
PS_DDR4_DQ62 PS_DDR_DQ62_504 W34
PS_DDR4_DQ63 PS_DDR_DQ63_504 Y34
PS_DDR4_DM0 PS_DDR_DM0_504 AN24
PS_DDR4_DM1 PS_DDR_DM1_504 AM29
PS_DDR4_DM2 PS_DDR_DM2_504 AH24
PS_DDR4_DM3 PS_DDR_DM3_504 AJ29
PS_DDR4_DM4 PS_DDR_DM4_504 AD29
PS_DDR4_DM5 PS_DDR_DM5_504 Y29
PS_DDR4_DM6 PS_DDR_DM6_504 AC32
PS_DDR4_DM7 PS_DDR_DM7_504 Y32
PS_DDR4_A0 PS_DDR_A0_504 AN34
PS_DDR4_A1 PS_DDR_A1_504 AM34
PS_DDR4_A2 PS_DDR_A2_504 AM33
PS_DDR4_A3 PS_DDR_A3_504 AL34
PS_DDR4_A4 PS_DDR_A4_504 AL33
PS_DDR4_A5 PS_DDR_A5_504 AK33
PS_DDR4_A6 PS_DDR_A6_504 AK30
PS_DDR4_A7 PS_DDR_A7_504 AJ30
PS_DDR4_A8 PS_DDR_A8_504 AJ31
PS_DDR4_A9 PS_DDR_A9_504 AH31
PS_DDR4_A10 PS_DDR_A10_504 AG31
PS_DDR4_A11 PS_DDR_A11_504 AF31
PS_DDR4_A12 PS_DDR_A12_504 AG30
PS_DDR4_A13 PS_DDR_A13_504 AF30
PS_DDR4_ODT0 PS_DDR_ODT0_504 AP32
PS_DDR4_PARITY PS_DDR_PARITY_504 AA26
PS_DDR4_RAS_B PS_DDR_A16_504 AF28
PS_DDR4_RESET_B PS_DDR_RAM_RST_N_504 AD26
PS_DDR4_WE_B PS_DDR_A14_504 AG29
PS_DDR4_ACT_B PS_DDR_ACT_N_504 AE25
PS_DDR4_ALERT_B PS_DDR_ALERT_N_504 AB26
PS_DDR4_BA0 PS_DDR_BA0_504 AE27
PS_DDR4_BA1 PS_DDR_BA1_504 AE28
PS_DDR4_BG0 PS_DDR_BG0_504 AD27
PS_DDR4_CAS_B PS_DDR_A15_504 AG28
PS_DDR4_CKE0 PS_DDR_CKE0_504 AN33
PS_DDR4_CS0_B PS_DDR_CS_N0_504 AP33
PS_DDR4_CLK0_N PS_DDR_CK_N0_504 AN32
PS_DDR4_CLK0_P PS_DDR_CK0_504 AL31

Table 3.2 - PS-Side DDR4 SDRAM Pin Assignment

QSPI FLASH ​

The BZ11 board is equipped with two 32MB Quad-SPI FLASH chips forming an 8-bit data bus. The FLASH model is MT25QU256ABA1EW9, which uses the 1.8V CMOS voltage standard. Due to the non-volatile nature of QSPI FLASH, it can be used as the boot device of the system to store boot images. These images mainly include the FPGA bit file, the ARM application code and other user data files. The specific model and related parameters of the QSPI FLASH are listed in Table 4.1.

Ref. DesignatorChip TypeCapacityManufacturer
U2、U3 MT25QU256ABA1EW9 256M bit Micron

Table 4.1 - QSPI Flash Model and Parameters

The QSPI FLASH is connected to the GPIO pins of PS BANK500 of the Zynq chip; in system design these PS GPIO pins must be configured as the QSPI FLASH interface. Figure 4.1 shows the QSPI FLASH in the schematic.

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Figure 4.1 - QSPI Flash Connection Diagram

Configuration Chip Pin Assignment:

Signal NamePin NamePin Number
MIO0_QSPI0_SCLK PS_MIO0_500 A24
MIO1_QSPI0_IO1 PS_MIO1_500 C24
MIO2_QSPI0_IO2 PS_MIO2_500 B24
MIO3_QSPI0_IO3 PS_MIO3_500 E25
MIO4_QSPI0_IO0 PS_MIO4_500 A25
MIO5_QSPI0_SS_B PS_MIO5_500 D25
MIO10_QSPI1_IO2 PS_MIO10_500 F26
MIO11_QSPI1_IO3 PS_MIO11_500 B26
MIO12_QSPI1_SCLK PS_MIO12_500 C27
MIO7_QSPI1_SS_B PS_MIO7_500 B25
MIO8_QSPI1_IO0 PS_MIO8_500 D26
MIO9_QSPI1_IO1 PS_MIO9_500 C26

Table 4.2 - QSPI Flash Pin Assignment

eMMC FLASH ​

The BZ11 development board is equipped with one large-capacity 32GB eMMC FLASH chip, model MTFC32GBCAQTC-IT. It supports the HS-MMC interface of the JEDEC e-MMC V5.0 standard, with 1.8V or 3.3V signaling. The data width between the eMMC FLASH and the Zynq is 8 bits. Due to its large capacity and non-volatile nature, the eMMC FLASH can serve as a high-capacity storage device in the Zynq system, for example to store ARM applications, system files and other user data files. The specific model and related parameters of the eMMC FLASH are listed in Table 5.1.

Ref. DesignatorChip TypeCapacityManufacturer
U8 MTFC32GBCAQTC-IT 32 GB Micron

Table 5.1 - eMMC Flash Model and Parameters

The eMMC FLASH is connected to the GPIO pins of PS BANK500 of the Zynq UltraScale+. In system design these PS GPIO pins must be configured as the eMMC interface. Figure 5.1 shows the eMMC FLASH in the schematic.

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Figure 5.1 - eMMC Flash Connection Diagram

Configuration Chip Pin Assignment:

Signal NamePin NamePin Number
MMC_CCLK PS_MIO22_500 F28
MMC_CMD PS_MIO21_500 C28
MMC_DAT0 PS_MIO13_500 D27
MMC_DAT1 PS_MIO14_500 A27
MMC_DAT2 PS_MIO15_500 E27
MMC_DAT3 PS_MIO16_500 A28
MMC_DAT4 PS_MIO17_500 C29
MMC_DAT5 PS_MIO18_500 F27
MMC_DAT6 PS_MIO19_500 B28
MMC_DAT7 PS_MIO20_500 E29
MMC_RSTN PS_MIO23_500 B29

Table 5.2 - eMMC Flash Pin Assignment

Clock Configuration ​

The BZ11 development board provides a reference clock and an RTC real-time clock for the PS. The clock circuit design is shown in Figure 6.1:

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Figure 6.1 - Core Board Clock Sources

PS RTC Real-Time Clock

The passive crystal Y1 on the board provides a 32.768kHz real-time clock source for the PS, connected to the PS_PADI_503 and PS_PADO_503 pins of Zynq BANK503.

Signal NamePin
PS_PADI_503 M25
PS_PADO_503 L25

Table 6.1 - Clock Pin Assignment

PS Clock Source

The X1 oscillator on the board provides a 33.333MHz clock input for the PS. The clock input is connected to the PS_REF_CLK_503 pin of Zynq BANK503. Clock pin assignment:

Signal NamePin
PS_REF_CLK R24

Table 6.2 - Clock Pin Assignment

M.2 Interface ​

The BZ11 development board is equipped with one standard PCIe Gen2 x1 M.2 interface for connecting M.2 SSDs, at 5Gbps. The M.2 interface uses an M-key socket and supports PCIe only, not SATA; when selecting an SSD, users must choose a PCIe SSD.

The PCIe signals are connected directly to the PS BANK505 MGT transceivers of the ZU11EG. One pair of TX and RX signals is connected to one MGT lane as differential signals. The PCIe clock is provided by the Si5332 chip at 100MHz. The M.2 circuit design is shown in Figure 7.1:

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Figure 7.1 - M.2 Interface Design Diagram

The Zynq pin assignment of the M.2 interface is as follows:

Signal NamePin NamePin NumberRemarks
PCIE_TX0_P 505_TX0_P U29 PCIe Lane 0 Transmit Positive
PCIE_TX0_N 505_TX0_N U30 PCIe Lane 0 Transmit Negative
PCIE_RX0_P 505_RX0_P U33 PCIe Lane 0 Receive Positive
PCIE_RX0_N 505_RX0_N U34 PCIe Lane 0 Receive Negative
PCIE_RST_N PS_MIO37 C33 PCIe Reset Signal
PCIE_REFCLK_P 505_CLK0_P T27 PCIe Reference Clock Positive
PCIE_REFCLK_N 505_CLK0_N T28 PCIe Reference Clock Negative

Table 7.1 - M.2 Interface Pin Assignment

DP Display Interface ​

The BZ11 development board provides one mini DisplayPort output interface for video image display. It supports the VESA DisplayPort V1.2a output standard, up to 4K x 2K@30Fps, and the Y-only, YCbCr444, YCbCr422, YCbCr420 and RGB video formats, with 6, 8, 10 or 12 bits per color.

The DisplayPort data lanes are driven directly by the PS MGT of ZU11EG BANK505; the LANE2 and LANE3 TX signals of the MGT are connected to the DP connector as differential signals. The DisplayPort auxiliary channel is connected to the MIO pins of the PS. The DP output interface design is shown in Figure 8.1:

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Figure 8.1 - DP Interface Design Diagram

The Zynq pin assignment of the DisplayPort interface is as follows:

Signal NameZYNQ Pin NamePin NumberRemarks
GT0_DP_TX_N 505_TX3_N N30 DP Data Low-Order Transmit Negative
GT0_DP_TX_P 505_TX3_P N29 DP Data Low-Order Transmit Positive
GT1_DP_TX_N 505_TX2_N P32 DP Data High-Order Transmit Negative
GT1_DP_TX_P 505_TX2_P P31 DP Data High-Order Transmit Positive
505_DP_CLKN 505_CLK2_N M32 DP Reference Clock Negative
505_DP_CLKP 505_CLK2_P M31 DP Reference Clock Positive
DP_AUX_OUT_MIO27 PS_MIO27 A30 DP Auxiliary Data Output
DP_AUX_IN_MIO30 PS_MIO30 A33 DP Auxiliary Data Input
DP_OE_MIO29 PS_MIO29 A32 DP Auxiliary Data Output Enable
DP_HPD_MIO28 PS_MIO28 A31 DP Hot Plug Detect

Table 8.1 - DisplayPort Pin Assignment

USB 3.0 Interface ​

The BZ11 development board has one USB 3.0 Type-C interface supporting HOST, SLAVE and OTG modes, with data transfer speeds of up to 5.0Gbps. USB 3.0 is connected through the PIPE3 interface, and USB 2.0 is connected to an external USB3320C chip through the ULPI interface, enabling high-speed USB 3.0 and USB 2.0 data communication. The USB 3.0 connection is shown in Figure 9.1:

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Figure 9.1 - USB 3.0 Interface Diagram

USB Interface Pin Assignment:

Signal NamePin NamePin NumberRemarks
USB_SSTXN 505_TX1_N R30 USB 3.0 Data Transmit Negative
USB_SSTXP 505_TX1_P R29 USB 3.0 Data Transmit Positive
USB_SSRXN 505_RX1_N T32 USB 3.0 Data Receive Negative
USB_SSRXP 505_RX1_P T31 USB 3.0 Data Receive Positive
USB_DATA0 PS_MIO56 G34 USB 2.0 Data Bit 0
USB_DATA1 PS_MIO57 H29 USB 2.0 Data Bit 1
USB_DATA2 PS_MIO54 G31 USB 2.0 Data Bit 2
USB_DATA3 PS_MIO59 H32 USB 2.0 Data Bit 3
USB_DATA4 PS_MIO60 H33 USB 2.0 Data Bit 4
USB_DATA5 PS_MIO61 H34 USB 2.0 Data Bit 5
USB_DATA6 PS_MIO62 J29 USB 2.0 Data Bit 6
USB_DATA7 PS_MIO63 J30 USB 2.0 Data Bit 7
USB_STP PS_MIO58 H31 USB 2.0 Stop Signal
USB_DIR PS_MIO53 G30 USB 2.0 Data Direction Signal
USB_CLK PS_MIO52 G29 USB 2.0 Clock Signal
USB_NXT PS_MIO55 G33 USB 2.0 Next Data Signal
USB_RESET_N PS_MIO26 A29 USB 2.0 Reset Signal
PS_IIC0_SCL PS_MIO34 B34 I2C Clock Signal
PS_IIC0_SDA PS_MIO35 C31 I2C Data Signal

Table 9.1 - USB Interface Pin Assignment

Gigabit Ethernet Interface ​

The BZ11 development board has one Gigabit Ethernet interface connected to the PS. The Ethernet chip is MICROCHIP's industrial-grade Ethernet PHY chip (KSZ9031RNX), providing network communication for users. The PS-side Ethernet PHY is connected to the GPIO interface of PS BANK502 of the Zynq. The KSZ9031RNX supports 10/100/1000 Mbps network rates and communicates with the MAC layer of the Zynq system through the RGMII interface. It supports MDI/MDX auto-adaptation, speed auto-adaptation and Master/SLAVE auto-adaptation, and supports the MDIO bus for PHY register management.

On power-up, the KSZ9031RNX detects the level states of certain IOs to determine its operating mode. Table 10.1 describes the default settings of the PHY chip after power-up.

Configuration PinDescriptionConfiguration Value
RXD3_ADR0 RXC_ADR1 RXCTL_ADR2 PHY Address in MDIO/MDC Mode PHY Address = 001
RXD1_TXDLY TX Clock 2ns Delay Delay
RXD0_RXDLY RX Clock 2ns Delay Delay

Table 10.1 - PHY Chip Default Configuration Values

At Gigabit Ethernet, data between the Zynq and the KSZ9031RNX PHY is transferred over the RGMII bus with a 125MHz clock, and data is sampled on both the rising and falling edges of the clock.

At 100 Mbps Ethernet, data between the Zynq and the KSZ9031RNX PHY is transferred over the RGMII bus with a 25MHz clock, and data is sampled on both the rising and falling edges of the clock. Figure 10.1 shows the connection of the Zynq Ethernet PHY1 chip:

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Figure 10.1 - ZYNQ and GPHY Connection Diagram

PS Gigabit Ethernet pin assignment is as follows:

Signal NamePin NamePin NumberRemarks
PHY1_TXCK PHY1_TXCK J31 Ethernet 1 RGMII Transmit Clock
PHY1_TXD0 PHY1_TXD0 J32 Ethernet 1 Transmit Data Bit 0
PHY1_TXD1 PHY1_TXD1 J34 Ethernet 1 Transmit Data Bit 1
PHY1_TXD2 PHY1_TXD2 K28 Ethernet 1 Transmit Data Bit 2
PHY1_TXD3 PHY1_TXD3 K29 Ethernet 1 Transmit Data Bit 3
PHY1_TXCTL PHY1_TXCTL K30 Ethernet 1 Transmit Enable Signal
PHY1_RXCK PHY1_RXCK K31 Ethernet 1 RGMII Receive Clock
PHY1_RXD0 PHY1_RXD0 K32 Ethernet 1 Receive Data Bit 0
PHY1_RXD1 PHY1_RXD1 K33 Ethernet 1 Receive Data Bit 1
PHY1_RXD2 PHY1_RXD2 K34 Ethernet 1 Receive Data Bit 2
PHY1_RXD3 PHY1_RXD3 L29 Ethernet 1 Receive Data Bit 3
PHY1_RXCTL PHY1_RXCTL L30 Ethernet 1 Receive Data Valid Signal
PHY1_MDC PHY1_MDC L33 Ethernet 1 MDIO Management Clock
PHY1_MDIO PHY1_MDIO L34 Ethernet 1 MDIO Management Data

Table 10.2 - PS Gigabit Ethernet Pin Assignment

UART Serial Interface ​

The BZ11 development board provides one UART interface connected to the PS, extended externally through a 3-pin 2.54mm pitch socket. It can be connected to the USB port of a PC with a TTL-to-USB cable for serial data communication. The UART circuit design is shown below:

image14.png

Figure 11.1 - USB-to-Serial Diagram

Zynq pin assignment of the serial port:

Signal NamePin NamePin NumberRemarks
PS_UART_RX PS_MIO42 D34 PS UART Data Input
PS_UART_TX PS_MIO43 E30 PS UART Data Output

Table 11.1 - USB-to-Serial Pin Assignment

Micro SD Card Socket ​

The BZ11 development board includes one Micro SD card socket, providing user access to Micro SD card storage for the ZU11EG BOOT program, the Linux operating system kernel, the file system and other user data files.

The SDIO signals are connected to the PS BANK501 IO signals of the ZU11EG. Because the VCCIO of BANK501 is set to 1.8V while Micro SD cards use 3.3V data levels, a TXS02612 level shifter is used here. The schematic of the ZU11EG PS and the Micro SD card connector is shown in Figure 12.1.

image15.png

Figure 12.1 - SD Card Connection Diagram

Micro SD Card Socket Pin Assignment

Signal NamePin NamePin NumberRemarks
SD_CLK SD_CLK F34 SD Clock Signal
SD_CD SD_CD E33 SD Detect Signal
SD_D0 SD_D0 E34 SD Data Data0
SD_D1 SD_D1 F30 SD Data Data1
SD_D2 SD_D2 F31 SD Data Data2
SD_D3 SD_D3 F32 SD Data Data3
SD_CMD SD_CMD F33 SD Card Command Signal

Table 12.1 - SD Card Socket Pin Assignment

QSFP+ Fiber Optic Interface ​

The BZ11 development board has a small-form-factor pluggable QSFP+ fiber optic interface. The optical transceiver integrates 4 transmit channels and 4 receive channels, and this 4-channel pluggable interface reaches a transmission rate of 40Gbps, meeting the demand for higher-density, high-speed pluggable optical communication solutions.

The QSFP+ optical transceiver signals are connected directly to the GTH transceivers of FPGA BANK228. The four TX and RX channels of the optical interface are connected directly to the GTH transceivers; since a single GTH lane supports up to 10Gbps bandwidth, the four GTH lanes can reach 40Gbps. The reference clock of the BANK228 GTH transceivers is provided by a 156.25MHz differential oscillator. The QSFP+ optical design of the development board is shown in Figure 13.1, where the optical module control signals are connected to FPGA BANK64.

image16.png

Figure 13.1 - QSFP+ Fiber Optic Design Diagram

FPGA pin assignment of the QSFP+ fiber optic interface is as follows:

Net NamePin NameFPGA PinRemarks
QSFP1_TX1_P 228_TX0_P M4 QSFP+ Channel 1 Data Transmit Positive
QSFP1_TX1_N 228_TX0_N M3 QSFP+ Channel 1 Data Transmit Negative
QSFP1_TX2_P 228_TX1_P L6 QSFP+ Channel 2 Data Transmit Positive
QSFP1_TX2_N 228_TX1_N L5 QSFP+ Channel 2 Data Transmit Negative
QSFP1_TX3_P 228_TX2_P K4 QSFP+ Channel 3 Data Transmit Positive
QSFP1_TX3_N 228_TX2_N K3 QSFP+ Channel 3 Data Transmit Negative
QSFP1_TX4_P 228_TX3_P H4 QSFP+ Channel 4 Data Transmit Positive
QSFP1_TX4_N 228_TX3_N H3 QSFP+ Channel 4 Data Transmit Negative
QSFP1_RX1_P 228_RX0_P N2 QSFP+ Channel 1 Data Receive Positive
QSFP1_RX1_N 228_RX0_N N1 QSFP+ Channel 1 Data Receive Negative
QSFP1_RX2_P 228_RX1_P L2 QSFP+ Channel 2 Data Receive Positive
QSFP1_RX2_N 228_RX1_N L1 QSFP+ Channel 2 Data Receive Negative
QSFP1_RX3_P 228_RX2_P J2 QSFP+ Channel 3 Data Receive Positive
QSFP1_RX3_N 228_RX2_N J1 QSFP+ Channel 3 Data Receive Negative
QSFP1_RX4_P 228_RX3_P G2 QSFP+ Channel 4 Data Receive Positive
QSFP1_RX4_N 228_RX3_N G1 QSFP+ Channel 4 Data Receive Negative
QSFP_MODSELL B64_IO_L5N AP15 Mode Select, low level enables I2C
QSFP_RESETL B64_IO_L5P AP16 Reset Signal, active low
QSFP_INTL B64_IO_L6N AN16 Interrupt Signal, active low
QSFP_LPMODE B64_IO_L6P AN17 Low Power Mode Select
QSFP_SCL B64_IO_T1U AL17 I2C Clock Signal
QSFP_SDA B64_IO_T2U AH16 I2C Data Signal

Table 13.1 - QSFP+ Fiber Optic Interface Pin Assignment

FMC Connectors ​

The BZ11 development board has four standard FMC HPC expansion connectors, which can be connected to FMC modules from Xilinx or ALINX (HDMI input/output module, dual-camera module, high-speed AD module, etc.). Because the FPGA does not have enough pins, not all FMC connectors are connected to the FPGA, so not all FMC modules can be used; which module can be used must be evaluated with reference to the schematic design. The hardware connection between the four FMC connectors and the FPGA is shown in Figure 14.1.

image17.png

Figure 14.1 - FMC Connector Connection Diagram

The pin assignment of the FMC1 connector is as follows:

FMC Pin NumberNet NameZYNQ Pin Number
G3 FMC1_CLK0_C2M_N F10
G2 FMC1_CLK0_C2M_P G10
H5 FMC1_CLK0_M2C_N E14
H4 FMC1_CLK0_M2C_P E15
K4 FMC1_CLK1_M2C_P H14
F5 FMC1_HA00_N E5
F4 FMC1_HA00_P F6
K8 FMC1_HA02_N B1
K7 FMC1_HA02_P C1
J7 FMC1_HA03_N C2
J6 FMC1_HA03_P D2
F8 FMC1_HA04_N F4
F7 FMC1_HA04_P F5
E7 FMC1_HA05_N D4
E6 FMC1_HA05_P E4
K11 FMC1_HA06_N A2
K10 FMC1_HA06_P A3
J10 FMC1_HA07_N B3
J9 FMC1_HA07_P C3
F11 FMC1_HA08_N B4
F10 FMC1_HA08_P C4
J13 FMC1_HA11_N E2
J12 FMC1_HA11_P E3
F14 FMC1_HA12_N A5
F13 FMC1_HA12_P B5
E13 FMC1_HA13_N D5
E12 FMC1_HA13_P D6
J16 FMC1_HA14_N D1
J15 FMC1_HA14_P E1
F17 FMC1_HA15_N J19
F16 FMC1_HA15_P J20
E16 FMC1_HA16_N L16
E15 FMC1_HA16_P L17
K17 FMC1_HA17_N G13
K16 FMC1_HA17_P A9
K13 FMC1_HA10_P D7
E10 FMC1_HA09_N A11
E9 FMC1_HA09_P B11
J21 FMC1_HA22_P E13
K26 FMC1_HB00_CC_N L13
K25 FMC1_HB00_CC_P M13
J25 FMC1_HB01_N J11
J24 FMC1_HB01_P K12
F23 FMC1_HB02_N J14
F22 FMC1_HB02_P K14
E22 FMC1_HB03_N J10
E21 FMC1_HB03_P K10
F26 FMC1_HB04_N L11
F25 FMC1_HB04_P L12
E25 FMC1_HB05_N B15
E24 FMC1_HB05_P B16
K29 FMC1_HB06_CC_N A12
K28 FMC1_HB06_CC_P A13
J28 FMC1_HB07_N B13
J27 FMC1_HB07_P B14
F29 FMC1_HB08_N A14
F28 FMC1_HB08_P A15
E28 FMC1_HB09_N A16
E27 FMC1_HB09_P A17
G7 FMC1_LA00_CC_N F15
G6 FMC1_LA00_CC_P G15
D9 FMC1_LA01_CC_N F16
D8 FMC1_LA01_CC_P F17
H8 FMC1_LA02_N G19
H7 FMC1_LA02_P H19
G10 FMC1_LA03_N G16
G9 FMC1_LA03_P H16
H11 FMC1_LA04_N F18
H10 FMC1_LA04_P G18
D12 FMC1_LA05_N H17
D11 FMC1_LA05_P H18
C11 FMC1_LA06_N K15
C10 FMC1_LA06_P L15
H14 FMC1_LA07_N K18
H13 FMC1_LA07_P K19
G13 FMC1_LA08_N J17
G12 FMC1_LA08_P K17
D15 FMC1_LA09_N J15
D14 FMC1_LA09_P J16
C15 FMC1_LA10_N C12
C14 FMC1_LA10_P C13
H17 FMC1_LA11_N E17
H16 FMC1_LA11_P E18
G16 FMC1_LA12_N K20
G15 FMC1_LA12_P L20
D18 FMC1_LA13_N C17
D17 FMC1_LA13_P D17
C19 FMC1_LA14_N C16
C18 FMC1_LA14_P D16
H20 FMC1_LA15_N F13
H19 FMC1_LA15_P G14
G19 FMC1_LA16_N D14
G18 FMC1_LA16_P D15
D21 FMC1_LA17_CC_N E10
D20 FMC1_LA17_CC_P F11
C23 FMC1_LA18_CC_N G11
C22 FMC1_LA18_CC_P H11
H23 FMC1_LA19_N C11
H22 FMC1_LA19_P D12
G22 FMC1_LA20_N D10
G21 FMC1_LA20_P D11
H26 FMC1_LA21_N A6
H25 FMC1_LA21_P B6
G25 FMC1_LA22_N B8
G24 FMC1_LA22_P B9
D24 FMC1_LA23_N A10
D23 FMC1_LA23_P B10
H29 FMC1_LA24_N E12
H28 FMC1_LA24_P F12
G28 FMC1_LA25_N K13
G27 FMC1_LA25_P L14
D27 FMC1_LA26_N C6
D26 FMC1_LA26_P C7
C27 FMC1_LA27_N A7
C26 FMC1_LA27_P A8
H32 FMC1_LA28_N H12
H31 FMC1_LA28_P H13
G31 FMC1_LA29_N E7
G30 FMC1_LA29_P F7
H35 FMC1_LA30_N C8
H34 FMC1_LA30_P C9
G34 FMC1_LA31_N E8
G33 FMC1_LA31_P F8
H38 FMC1_LA32_N D9
H37 FMC1_LA32_P E9
G37 FMC1_LA33_N G9
G36 FMC1_LA33_P H9

Table 14.1 - FMC1 Connector Pin Assignment

The pin assignment of the FMC2 connector is as follows:

FMC Pin NumberNet NameZYNQ Pin Number
G3 FMC2_CLK0_C2M_N AK9
G2 FMC2_CLK0_C2M_P AJ9
H5 FMC2_CLK0_M2C_N F21
H4 FMC2_CLK0_M2C_P G21
K4 FMC2_CLK1_M2C_P E20
F5 FMC2_HA00_N G6
F4 FMC2_HA00_P H6
K8 FMC2_HA02_N G8
K7 FMC2_HA02_P H8
J7 FMC2_HA03_N J9
J6 FMC2_HA03_P K9
F8 FMC2_HA04_N K8
F7 FMC2_HA04_P L8
E7 FMC2_HA05_N J6
E6 FMC2_HA05_P J7
K11 FMC2_HA06_N N12
K10 FMC2_HA06_P P12
J10 FMC2_HA07_N L10
J9 FMC2_HA07_P M10
F11 FMC2_HA08_N M8
F10 FMC2_HA08_P M9
E10 FMC2_HA09_N AP8
E9 FMC2_HA09_P AM13
J13 FMC2_HA11_N G7
J12 FMC2_HA11_P H7
F14 FMC2_HA12_N M11
F13 FMC2_HA12_P N11
E13 FMC2_HA13_N N8
E12 FMC2_HA13_P N9
J16 FMC2_HA14_N M12
J15 FMC2_HA14_P N13
F17 FMC2_HA15_N AC13
F16 FMC2_HA15_P AB13
E16 FMC2_HA16_N B21
E15 FMC2_HA16_P B20
K17 FMC2_HA17_N AH8
K16 FMC2_HA17_P AC14
K13 FMC2_HA10_P F25
J21 FMC2_HA22_P B23
K26 FMC2_HB00_CC_N L22
K25 FMC2_HB00_CC_P L21
J25 FMC2_HB01_N K24
J24 FMC2_HB01_P L23
F23 FMC2_HB02_N K23
F22 FMC2_HB02_P K22
E22 FMC2_HB03_N J22
E21 FMC2_HB03_P J21
F26 FMC2_HB04_N H26
F25 FMC2_HB04_P J25
E25 FMC2_HB05_N AF12
E24 FMC2_HB05_P AE12
K29 FMC2_HB06_CC_N AD12
K28 FMC2_HB06_CC_P AC12
J28 FMC2_HB07_N AF13
J27 FMC2_HB07_P AE13
F29 FMC2_HB08_N AE14
F28 FMC2_HB08_P AD14
E28 FMC2_HB09_N AF10
E27 FMC2_HB09_P AF11
G7 FMC2_LA00_CC_N G24
G6 FMC2_LA00_CC_P G23
D9 FMC2_LA01_CC_N E23
D8 FMC2_LA01_CC_P F23
H8 FMC2_LA02_N D24
H7 FMC2_LA02_P E24
G10 FMC2_LA03_N G26
G9 FMC2_LA03_P G25
H11 FMC2_LA04_N C22
H10 FMC2_LA04_P C21
D12 FMC2_LA05_N C23
D11 FMC2_LA05_P D22
C11 FMC2_LA06_N A23
C10 FMC2_LA06_P A22
H14 FMC2_LA07_N B19
H13 FMC2_LA07_P B18
G13 FMC2_LA08_N A21
G12 FMC2_LA08_P A20
D15 FMC2_LA09_N C19
D14 FMC2_LA09_P C18
C15 FMC2_LA10_N H24
C14 FMC2_LA10_P J24
H17 FMC2_LA11_N D21
H16 FMC2_LA11_P D20
G16 FMC2_LA12_N A19
G15 FMC2_LA12_P A18
D18 FMC2_LA13_N H22
D17 FMC2_LA13_P H21
C19 FMC2_LA14_N D19
C18 FMC2_LA14_P E19
H20 FMC2_LA15_N F20
H19 FMC2_LA15_P G20
G19 FMC2_LA16_N E22
G18 FMC2_LA16_P F22
D21 FMC2_LA17_CC_N AJ11
D20 FMC2_LA17_CC_P AH11
C23 FMC2_LA18_CC_N AJ12
C22 FMC2_LA18_CC_P AH12
H23 FMC2_LA19_N AG8
H22 FMC2_LA19_P AF8
G22 FMC2_LA20_N AG10
G21 FMC2_LA20_P AG11
H26 FMC2_LA21_N AL8
H25 FMC2_LA21_P AK8
G25 FMC2_LA22_N AK10
G24 FMC2_LA22_P AJ10
D24 FMC2_LA23_N AL12
D23 FMC2_LA23_P AK12
H29 FMC2_LA24_N AH9
H28 FMC2_LA24_P AG9
G28 FMC2_LA25_N AM8
G27 FMC2_LA25_P AM9
D27 FMC2_LA26_N AL13
D26 FMC2_LA26_P AK13
C27 FMC2_LA27_N AL10
C26 FMC2_LA27_P AL11
H32 FMC2_LA28_N AH13
H31 FMC2_LA28_P AG13
G31 FMC2_LA29_N AP12
G30 FMC2_LA29_P AN12
H35 FMC2_LA30_N AN8
H34 FMC2_LA30_P AN9
G34 FMC2_LA31_N AM10
G33 FMC2_LA31_P AM11
H38 FMC2_LA32_N AP11
H37 FMC2_LA32_P AN11
G37 FMC2_LA33_N AP9
G36 FMC2_LA33_P AP10

Table 14.2 - FMC2 Connector Pin Assignment

The pin assignment of the FMC3 connector is as follows:

FMC Pin NumberNet NameZYNQ Pin Number
G3 FMC3_CLK0_C2M_N AJ22
G2 FMC3_CLK0_C2M_P AJ21
H5 FMC3_CLK0_M2C_N AJ15
H4 FMC3_CLK0_M2C_P AJ16
C3 FMC3_DP0_C2M_N U5
C2 FMC3_DP0_C2M_P U6
C7 FMC3_DP0_M2C_N V3
C6 FMC3_DP0_M2C_P V4
A23 FMC3_DP1_C2M_N T3
A22 FMC3_DP1_C2M_P T4
A3 FMC3_DP1_M2C_N U1
A2 FMC3_DP1_M2C_P U2
A27 FMC3_DP2_C2M_N R5
A26 FMC3_DP2_C2M_P R6
A7 FMC3_DP2_M2C_N R1
A6 FMC3_DP2_M2C_P R2
A31 FMC3_DP3_C2M_N N5
A30 FMC3_DP3_C2M_P N6
A11 FMC3_DP3_M2C_N P3
A10 FMC3_DP3_M2C_P P4
A35 FMC3_DP4_C2M_N AC5
A34 FMC3_DP4_C2M_P AC6
A15 FMC3_DP4_M2C_N AC1
A14 FMC3_DP4_M2C_P AC2
A39 FMC3_DP5_C2M_N AA5
A38 FMC3_DP5_C2M_P AA6
A19 FMC3_DP5_M2C_N AB3
A18 FMC3_DP5_M2C_P AB4
B37 FMC3_DP6_C2M_N Y3
B36 FMC3_DP6_C2M_P Y4
B17 FMC3_DP6_M2C_N AA1
B16 FMC3_DP6_M2C_P AA2
B33 FMC3_DP7_C2M_N W5
B32 FMC3_DP7_C2M_P W6
B13 FMC3_DP7_M2C_N W1
B12 FMC3_DP7_M2C_P W2
G7 FMC3_LA00_CC_N AG18
G6 FMC3_LA00_CC_P AF18
D9 FMC3_LA01_CC_N AH17
D8 FMC3_LA01_CC_P AH18
H8 FMC3_LA02_N AJ14
H7 FMC3_LA02_P AH14
G10 FMC3_LA03_N AG14
G9 FMC3_LA03_P AG15
H11 FMC3_LA04_N AF15
H10 FMC3_LA04_P AF16
D12 FMC3_LA05_N AF17
D11 FMC3_LA05_P AE17
C11 FMC3_LA06_N AA15
C10 FMC3_LA06_P AA16
H14 FMC3_LA07_N AB15
H13 FMC3_LA07_P AB16
G13 FMC3_LA08_N AB14
G12 FMC3_LA08_P AA14
D15 FMC3_LA09_N AC16
D14 FMC3_LA09_P AC17
C15 FMC3_LA10_N AD16
C14 FMC3_LA10_P AD17
H17 FMC3_LA11_N AL18
H16 FMC3_LA11_P AK18
G16 FMC3_LA12_N AE15
G15 FMC3_LA12_P AD15
D18 FMC3_LA13_N AK14
D17 FMC3_LA13_P AK15
C19 FMC3_LA14_N AM15
C18 FMC3_LA14_P AM16
H20 FMC3_LA15_N AL15
H19 FMC3_LA15_P AL16
G19 FMC3_LA16_N AK17
G18 FMC3_LA16_P AJ17
D21 FMC3_LA17_CC_N AH21
D20 FMC3_LA17_CC_P AG21
C23 FMC3_LA18_CC_N AH23
C22 FMC3_LA18_CC_P AH22
H23 FMC3_LA19_N AN19
H22 FMC3_LA19_P AM19
G22 FMC3_LA20_N AF22
G21 FMC3_LA20_P AF21
H26 FMC3_LA21_N AB18
H25 FMC3_LA21_P AA18
G25 FMC3_LA22_N AC19
G24 FMC3_LA22_P AB19
D24 FMC3_LA23_N AD19
D23 FMC3_LA23_P AC18
H29 FMC3_LA24_N AG20
H28 FMC3_LA24_P AG19
G28 FMC3_LA25_N AA20
G27 FMC3_LA25_P AA19
D27 FMC3_LA26_N AE19
D26 FMC3_LA26_P AE18
C27 FMC3_LA27_N AE20
C26 FMC3_LA27_P AD20
H32 FMC3_LA28_N AG23
H31 FMC3_LA28_P AF23
G31 FMC3_LA29_N AL21
G30 FMC3_LA29_P AL20
H35 FMC3_LA30_N AK19
H34 FMC3_LA30_P AJ19
G34 FMC3_LA31_N AK20
G33 FMC3_LA31_P AJ20
H38 FMC3_LA32_N AK23
H37 FMC3_LA32_P AK22
G37 FMC3_LA33_N AL23
G36 FMC3_LA33_P AL22
D5 FMC3_GBTCLK0_M2C_N W9
D4 FMC3_GBTCLK0_M2C_P W10
B21 FMC3_GBTCLK1_M2C_N Y7
B20 FMC3_GBTCLK1_M2C_P Y8

Table 14.3 - FMC3 Connector Pin Assignment

The pin assignment of the FMC4 connector is as follows:

FMC Pin NumberNet NameZYNQ Pin Number
D5 FMC4_GBTCLK0_M2C_N AC9
D4 FMC4_GBTCLK0_M2C_P AC10
B21 FMC4_GBTCLK1_M2C_N AD7
B20 FMC4_GBTCLK1_M2C_P AD8
C3 FMC4_DP0_C2M_N AD3
C2 FMC4_DP0_C2M_P AD4
C7 FMC4_DP0_M2C_N AE1
C6 FMC4_DP0_M2C_P AE2
A23 FMC4_DP1_C2M_N AE5
A22 FMC4_DP1_C2M_P AE6
A3 FMC4_DP1_M2C_N AF3
A2 FMC4_DP1_M2C_P AF4
A27 FMC4_DP2_C2M_N AG5
A26 FMC4_DP2_C2M_P AG6
A7 FMC4_DP2_M2C_N AG1
A6 FMC4_DP2_M2C_P AG2
A31 FMC4_DP3_C2M_N AH3
A30 FMC4_DP3_C2M_P AH4
A11 FMC4_DP3_M2C_N AJ1
A10 FMC4_DP3_M2C_P AJ2
A35 FMC4_DP4_C2M_N AN5
A34 FMC4_DP4_C2M_P AN6
A15 FMC4_DP4_M2C_N AP3
A14 FMC4_DP4_M2C_P AP4
A39 FMC4_DP5_C2M_N AM3
A38 FMC4_DP5_C2M_P AM4
A19 FMC4_DP5_M2C_N AN1
A18 FMC4_DP5_M2C_P AN2
B37 FMC4_DP6_C2M_N AL5
B36 FMC4_DP6_C2M_P AL6
B17 FMC4_DP6_M2C_N AL1
B16 FMC4_DP6_M2C_P AL2
B33 FMC4_DP7_C2M_N AJ5
B32 FMC4_DP7_C2M_P AJ6
B13 FMC4_DP7_M2C_N AK3
B12 FMC4_DP7_M2C_P AK4
H8 FMC4_LA02_N AN18
H7 FMC4_LA02_P AM18
G10 FMC4_LA03_N AP17
G9 FMC4_LA03_P AP18
G13 FMC4_LA08_N AN14
G12 FMC4_LA08_P AM14
G16 FMC4_LA12_N AP13
G15 FMC4_LA12_P AN13
H20 FMC4_LA15_N AP20
H19 FMC4_LA15_P AP19
H23 FMC4_LA19_N AN21
H22 FMC4_LA19_P AM21
H26 FMC4_LA21_N AP23
H25 FMC4_LA21_P AN22
G25 FMC4_LA22_N AP22
G24 FMC4_LA22_P AP21
G28 FMC4_LA25_N AN23
G27 FMC4_LA25_P AM23
G31 FMC4_LA29_N AE24
G30 FMC4_LA29_P AE23

Table 14.4 - FMC4 Connector Pin Assignment

JTAG Debug Port ​

A JTAG interface is reserved on the BZ11 development board for downloading Zynq UltraScale+ programs or programming the FLASH. To avoid damage to the Zynq UltraScale+ chip caused by hot plugging, protection diodes are added on the JTAG signals to keep the signal voltage within the range accepted by the FPGA.

EEPROM ​

The BZ11 development board has an onboard EEPROM, model 24LC04, with a capacity of 4Kbit (22568 bits), connected to the PS through the I2C bus for communication. The EEPROM and the temperature sensor are mounted on the I2C bus of Zynq UltraScale+ BANK501 MIO. Figure 16.1 shows the schematic of the EEPROM and the temperature sensor:

image18.png

Figure 16.1 - EEPROM and Sensor Schematic

EEPROM communication pin assignment is as follows:

Signal NamePin NamePin NumberRemarks
PS_IIC0_SCL PS_MIO34 B34 I2C Clock Signal
PS_IIC0_SDA PS_MIO35 C31 I2C Data Signal

Table 16.1 - EEPROM Communication Pin Assignment

LEDs ​

The BZ11 development board has 4 LEDs and 2 dual-layer LEDs, including one power indicator, one DONE indicator, and PS control indicators connected to the dual-layer LEDs, plus two user indicators. Users can switch them on and off through programs. The hardware connection of the user LEDs is shown in Figure 17.1:

image19.png

Figure 17.1 - User LED Hardware Connection Diagram

User LED Pin Assignment

Signal NamePin NamePin NumberRemarks
PS_LED1 PS_MIO44 E32 User PS LED 1
PS_LED2 PS_MIO38 C34 User PS LED 2

Table 17.1 - User LED Pin Assignment

Button ​

The BZ11 development board has one RESET button whose reset signal is connected to the MIO of the PS; users can use this button to reset the Zynq system. The reset button is active low. The button connection is shown in Figure 18.1:

image20.png

Figure 18.1 - Reset Button Connection Diagram

Zynq Pin Assignment of the Button

Signal NamePin NamePin NumberRemarks
SYS_RESET PS_MIO26 A29 PS Button Input

Table 18.1 - ZYNQ Pin Assignment of the Button

DIP Switch Configuration ​

The board has a 4-position DIP switch SW1 for configuring the boot mode of the Zynq system. The BZ11 platform supports 4 boot modes: JTAG debug mode, QSPI FLASH, eMMC and SD 2.0 card boot mode. After power-up, the ZU11EG chip detects the levels of PS_MODE0~3 to determine the boot mode. Users can select different boot modes with DIP switch SW1 on the expansion board. The SW1 boot mode configuration is shown in Table 19.1.

SW1DIP Switch Position (1, 2, 3, 4)MODE[3:0]Boot Mode

image21.png

ON、ON、ON、ON 0000 PS JTAG
ON、ON、OFF、ON 0010 QSPI FLASH
ON、OFF、ON、OFF 0101 SD Card
ON、OFF、OFF、ON 0110 eMMC

Table 19.1 - SW1 Boot Mode Configuration

Power ​

The power input voltage of the BZ11 development board is +9V to +36V. On the board, the LM5176 buck-boost converter converts it to +12V, which is then converted by five DC/DC converters into +5V, QSFP_3.3V, +1.8V and FMC_VADJ. The power design of the board is shown below:

image22.png

Figure 20.1 - Power Interface in the Schematic

In addition, a PMIC chip TPS6508640 on the board generates all the other power supplies required by the XCZU11EG. For the TPS6508640 power design, please refer to the power chip manual. The design block diagram is as follows:

image23.png

Figure 20.2 - Power Design Block Diagram

The functions assigned to each power rail are shown in the table below:

PowerFunction
+5.0V USB power supply
+1.8V Ethernet and USB power supply
QSFP_+3.3V QSFP power supply
FMC_VADJ FMC and FPGA chip BANK voltage

Table 20.1 - Power Rail Function Assignment

Fan ​

Because the ZU11EG generates a large amount of heat during normal operation, we have added a heatsink and a fan on the board for the chip to prevent overheating. The fan is controlled by the Zynq chip, with the control pin connected to the IO of BANK65 (PIN AM20). If the IO level is low, the MOSFET turns on and the fan works; if the IO level is high, the fan stops.

The fan is fixed to the development board with screws before shipment. The fan power is connected to the J11 socket, with red as the positive terminal and black as the negative terminal.

Mechanical Dimensions ​

image24.png

Figure 22.1 - Front View (Top View)

Appendix: List of Abbreviations ​

AbbreviationFull English NameDescription
PS Processor System The processing subsystem in an SoC, typically including CPU cores, memory controllers, and peripheral interfaces.
PL Programmable Logic User-configurable FPGA logic resources for implementing custom digital circuits and hardware acceleration.
SoC System on Chip An integrated circuit combining processors, memory controllers, and peripheral interfaces on a single chip.
DDR4 Double Data Rate 4 SDRAM Fourth-generation synchronous dynamic memory technology transferring data on both clock edges.
eMMC Embedded Multi Media Card An embedded non-volatile storage device integrating NAND Flash and a controller in one package.
QSPI Quad Serial Peripheral Interface A high-speed serial interface using four data lines, commonly used for NOR Flash boot devices.
GTH Gigabit Transceiver High-speed serial transceivers in Xilinx FPGAs supporting multi-gigabit data rates.
UART Universal Asynchronous Receiver/Transmitter An asynchronous serial communication interface using TX and RX lines.
DP DisplayPort A digital display interface standard for video and audio transmission.
PCIe Peripheral Component Interconnect Express A high-speed serial expansion bus standard.
USB Universal Serial Bus A standard serial interface for data communication and power delivery.
JTAG Joint Test Action Group A standardized interface for device testing, boundary scan, and FPGA programming.
QSFP+ Quad Small Form-factor Pluggable Plus A high-density hot-pluggable optical transceiver supporting up to 40Gbps.
MIO Multiplexed I/O Multiplexed processor I/O pins configurable as UART, I2C, SPI, or GPIO.
PHY Physical Layer Transceiver An analog front-end device that converts digital data to/from physical network signals.
I2C Inter-Integrated Circuit A two-wire serial bus using SDA and SCL for connecting peripherals.
RGMII Reduced Gigabit Media Independent Interface A reduced-pin-count Ethernet MAC-to-PHY interface supporting up to 1000Mbps.
FMC FPGA Mezzanine Card A standard mezzanine connector for FPGA I/O expansion.
LED Light Emitting Diode A semiconductor device that emits light, used for status indication.
CANFD Controller Area Network Flexible Data Rate An upgraded CAN bus standard supporting flexible data rates up to 5Mbps.
GPS Global Positioning System A satellite-based navigation system providing location and time synchronization.
EEPROM Electrically Erasable Programmable Read-Only Memory A non-volatile memory that can be erased and rewritten electrically.
DDR Double Data Rate Memory technology transferring data on both rising and falling clock edges.
PMIC Power Management IC A chip that integrates multiple power conversion and management functions.

Contact information ​

Alinx Electronic Limited

Company Website: www.en.alinx.com

Service Hotline: +86 21 67676997

Technical Support:technical@alinx.com