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PI-ZN010-F1-1 User Manual ​

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  Alinx Electronic Limited

Company Website: www.en.alinx.com

Service Hotline: +86 21 67676997

Technical Support : technical@alinx.com


Document Information ​

ItemContent
Document Name User Manual
Product Model PI-ZN010-F1-1
Document Version V1.0
Prepared by Alinx Electronic Limited
Release Date 2026.10.13

Document Revision History ​

VersionDateSectionRevision Summary
V1.0 2026.10.13 All Initial Release

The development board based on the XILINX ZYNQ7000 development platform, model PI-ZN010-F1-1, was officially released in 2026. This development platform is a solution built on Xilinx's Zynq-7000 SoC chips. It uses ARM+FPGA SoC technology to integrate a dual-core ARM Cortex-A9 and FPGA programmable logic into a single chip. It uses the Xilinx Zynq-7000 series XC7Z010-1CLG400C as the core processor, offering rich hardware resources and peripheral interfaces on both the ARM and FPGA sides. The design adheres to the philosophy of "exquisite, practical and concise." It is suitable not only for software engineers to conduct early-stage software verification, but also for hardware engineers to carry out hardware design and software/hardware system co-development, accelerating the project development process.

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Chapter 1 Introduction ​

Here we provide a brief introduction to the features of this ZYNQ7000 development platform, the PI-ZN010-F1-1.

This development board uses a Xilinx Zynq-7000 series chip, model XC7Z010-1CLG400C, in a 400-pin FBGA package. The ZYNQ7000 chip can be divided into the Processor System (PS) and the Programmable Logic (PL). On the PI-ZN010-F1-1 development board, both the PS and the PL of the ZYNQ7000 are equipped with rich external interfaces and devices for convenient use and functional verification. In addition, the board integrates a Xilinx USB Cable downloader circuit, so users only need a USB cable to download and debug the board. Figure 1.1.1 shows the system block diagram of the PI-ZN010-F1-1:

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Figure 1.1.1 – PI-ZN010-F1-1 System Block Diagram

From this block diagram, we can see the interfaces and functions of this development platform:

  • TYPE-C power input, with a reserved external 5V power connector;

  • Xilinx ARM+FPGA chip Zynq-7000 XC7Z010-1CLG400C;

  • One 2Gbit high-speed DDR3 SDRAM, which can be used as data cache for the ZYNQ chip or as memory for running an operating system;

  • One 128Mbit QSPI FLASH, used for storing the ZYNQ chip's system files and user data;

  • One 10/100/1000M Ethernet RJ-45 interface for Ethernet data exchange with a PC or other network devices;

  • One HDMI video output interface, supporting 1080P video transmission;

  • One LCD interface, compatible with a 4.3-inch TFT module;

  • One MIPI camera interface, compatible with the Alinx MIPI OV5640 camera;

  • One high-speed USB2.0 HOST/DEVICE interface for connecting USB peripherals such as a mouse, keyboard and USB flash drive to the board;

  • One high-speed USB2.0 OTG interface for OTG communication with a PC or USB devices;

  • 1 PL-controlled LED;

  • 2 buttons: 1 CPU reset button and 1 PL-controlled button;

  • An onboard 33.333MHz active crystal oscillator providing a stable clock source for the PS system, and a 50MHz active crystal oscillator providing an additional clock for the PL logic;

  • One 40-pin expansion connector (2.54mm pitch) for expanding the IO of the ZYNQ PL, compatible with expansion modules such as 7-inch TFT modules, camera modules and AD/DA modules;

  • One TYPE-C interface for debugging and downloading the ZYNQ system via a TYPE-C cable and the onboard JTAG circuit;

  • 1 Micro SD card slot (on the back of the board) for storing the operating system image and file system.

Chapter 2 Structure and Dimensions ​

The development board measures a compact 100mm x 70mm and uses an 8-layer PCB design. Four screw mounting holes with a diameter of 3.5mm are provided around the board for fixing it. A dxf structural drawing is included in the documentation package.

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Figure 2.1.1 – Structural Drawing

Chapter 3 Power Supply ​

Power input: The development board is powered at 5V, supplied directly through the TYPE-C interface, or alternatively by an external DC5V supply. The power design of the board is shown in the following diagram:

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Figure 3.1.1 – Power Interface Section in the Schematic

The board is powered by +5V, which is converted by four DC/DC power chips into four rails: +3.3V, +1.5V, +1.8V and +1.0V. Three of the outputs can deliver up to 3A, and the core supply can provide up to 4A. The 1.5V rail generates the VTT and VREF voltages required by the DDR3 through the TI TPS51206. The function of each power rail is shown in the table below:

Power RailFunction
+3.3V ZYNQ VCCIO, Ethernet, JTAG, HDMI, NOR flash, WIFI/BT module and SD card
+1.8V ZYNQ auxiliary voltage, ZYNQ PLL, ZYNQ Bank501 VCCIO, Ethernet, USB2.0
+1.0V ZYNQ core voltage
+1.5V DDR3, ZYNQ Bank502
VREF, VTT DDR3

Table 3.1.1 – Power Rail Allocation

Because the PS and PL power domains of the ZYNQ have power-up sequencing requirements, the circuit design follows the ZYNQ power requirements, with the power-on sequence of 1.0V -> 1.8V -> 1.5V -> 3.3V.

When designing the PCB, we used an 8-layer board with dedicated power and ground planes, giving the board's power supply excellent stability. Test points for each power rail are reserved on the PCB so that users can verify the voltages on the board.

Chapter 4 ZYNQ7000 ​

The development board uses a Xilinx Zynq-7000 series chip, model XC7Z010-1CLG400C. The PS of the chip integrates two ARM Cortex™-A9 processors, AMBA® interconnect, internal memory, external memory interfaces and peripherals. These peripherals mainly include USB bus interfaces, Ethernet interfaces, SD/SDIO interfaces, I2C bus interfaces, CAN bus interfaces, UART interfaces and GPIO. The PS can run independently and boots at power-on or reset. The overall block diagram of the ZYNQ7000 chip is shown in Figure 4.1.1:

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Figure 4.1.1 – ZYNQ7000 Chip Block Diagram

The main parameters of the PS are as follows:

  • Application processor based on dual-core ARM Cortex-A9

  • 32KB L1 instruction and data cache per CPU, 512KB L2 cache shared by the two CPUs

  • On-chip boot ROM and 256KB on-chip RAM

  • External memory interface supporting 16/32-bit DDR2 and DDR3

  • Two Gigabit Ethernet controllers supporting: scatter-gather DMA, GMII, RGMII, SGMII interfaces

  • Two USB2.0 OTG interfaces, each supporting up to 12 nodes

  • Two CAN2.0B bus interfaces

  • Two SD card, SDIO, MMC-compatible controllers

  • 2 SPI, 2 UARTs, 2 I2C interfaces

  • 4 groups of 32-bit GPIO: 54 (32+22) used as PS system IO, 64 connected to PL

  • High-bandwidth connections within the PS and from PS to PL

The main parameters of the PL are as follows:

  • Logic Cells: 28K

  • LUTs: 17600

  • Flip-flops: 35200

  • 18x25 MACCs: 80

  • Block RAM: 2.1Mb

  • Two AD converters that can measure on-chip voltage, temperature and up to 17 external differential input channels at 1MBPS

The XC7Z010-1CLG400C chip is in a BGA package with 400 pins and a 0.8mm pin pitch. A note on BGA pins: when a BGA-packaged chip is used, pin names take the form of letter+number, such as E3, G3, etc. Therefore, when you look at the schematic, pins in the letter+number format represent BGA pins.

4.1 JTAG Interface ​

First, let's look at the JTAG debug interface of the PI-ZN010-F1-1 development board. The JTAG download and debug circuit is integrated on the board, so users do not need to purchase an additional Xilinx downloader. A single USB cable is enough for ZYNQ development and debugging. On the PI-ZN010-F1-1, an FTDI USB bridge chip FT2232HL is used to provide data communication between the PC's USB and the ZYNQ's JTAG debug signals TCK, TDO, TMS and TDI, as well as UART debug functionality.

On the PI-ZN010-F1-1 development board, the JTAG interface takes the form of a USB interface. Users can connect the PC to the JTAG interface with the USB cable provided by us to debug the ZYNQ system.

4.2 FPGA Power Supply System ​

Next, we describe the power design of the PI-ZN010-F1-1. The power supply of the ZYNQ chip is divided into the PS and the PL parts, which operate independently. Both the PS power and the PL power have power-up sequencing requirements; an incorrect power-up sequence may prevent the ARM and FPGA systems from working properly.

The PS power consists of VCCPINT, VCCPAUX, VCCPLL and PS VCCO. VCCPINT is the PS core power pin, connected to 1.0V; VCCPAUX is the PS auxiliary power pin, connected to 1.8V; VCCPLL is the power pin for the PS internal clock PLL, also connected to 1.8V; PS VCCO is the bank voltage, including VCCO_MIO0, VCCO_MIO1 and VCCO_DDR. Depending on the peripherals connected, the supply voltages differ. On the PI-ZN010-F1-1, VCCO_MIO0 is connected to 3.3V, VCCO_MIO1 to 1.8V, and VCCO_DDR to 1.5V. The PS requires the power-up sequence of VCCPINT first, then VCCPAUX and VCCPLL, and finally PS VCCO. The power-down sequence is the reverse.

The PL power consists of VCCINT, VCCBRAM, VCCAUX and VCCO. VCCINT is the FPGA core power pin, connected to 1.0V; VCCBRAM is the FPGA Block RAM power pin, connected to 1.0V; VCCAUX is the FPGA auxiliary power pin, connected to 1.8V; VCCO is the voltage for the PL banks, including BANK13, BANK34 and BANK35. On the PI-ZN010-F1-1, the bank voltage is connected to 3.3V. The PL requires the power-up sequence of VCCINT first, then VCCBRAM, then VCCAUX, and finally VCCO. If VCCINT and VCCBRAM use the same voltage, they can be powered up simultaneously. The power-down sequence is the reverse.

4.3 ZYNQ Boot Configuration ​

The PI-ZN010-F1-1 development platform supports three boot modes: JTAG debug mode, QSPI FLASH boot mode and SD card boot mode. After power-on, the ZYNQ7010 chip detects the levels of the corresponding MIO pins to determine the boot mode. Users can select different boot modes via the SW1 DIP switch on the board. The SW1 boot mode configuration is shown in Table 4.3.1.

SW1DIP Switch Setting ON/OFF (2:1)Boot Mode

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00JTAG
01QSPI FLASH
11SD card

Table 4.3.1 – SW1 Boot Mode Configuration

Chapter 5 Clock Configuration ​

The PI-ZN010-F1-1 development board provides active clock sources for both the PS and the PL logic, allowing them to work independently.

5.1 PS System Clock Source ​

The ZYNQ chip receives a 33.333MHz clock input for the PS from the Y2 crystal oscillator on the board. The clock input is connected to the PS_CLK_500 pin of BANK500 on the ZYNQ chip. The clock pin assignment:

ZYNQ Pin NameZYNQ Pin
PS_CLK_500 E7

Table 5.1.1 – PS System Clock Source

5.2 PL System Clock Source ​

The PI-ZN010-F1-1 development board provides a single-ended 50MHz PL system clock source powered at 3.3V. The oscillator output is connected to the FPGA's global clock (MRCC); this GCLK can be used to drive user logic circuits inside the FPGA. PL clock pin assignment:

ZYNQ Pin NameZYNQ Pin
IO_L13P_T2_MRCC_34 N18

Table 5.2.1 – PL Clock Pin Assignment

Chapter 6 PS Peripherals ​

Since the ZYNQ consists of the ARM-based PS and the FPGA-based PL, some peripherals on the board are connected to the PS IO while others are connected to the PL IO. First, we introduce the peripherals connected to the PS.

6.1 QSPI Flash ​

The development board is equipped with a 128Mbit Quad-SPI FLASH chip, model GD25Q128ESIGR, which uses the 3.3V CMOS voltage standard. Thanks to the non-volatile nature of the QSPI FLASH, it can serve as the system boot device to store the boot images, including the FPGA bit file, ARM application code and other user data files. The specific model and related parameters of the QSPI FLASH are listed in Table 6.1.1.

DesignatorChip TypeCapacityManufacturer
U9 GD25Q128ESIGR 16M Byte Giga Device

Table 6.1.1 – QSPI Flash Model and Parameters

The QSPI FLASH is connected to the GPIO pins of BANK500 in the PS of the ZYNQ chip. In the system design, these PS GPIO pins need to be configured as the QSPI FLASH interface. Figure 6.1.1 shows the hardware connection diagram of the QSPI Flash.

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Figure 6.1.1 – QSPI Flash Connection Diagram

FLASH chip pin assignment:

Signal NameZYNQ Pin NameZYNQ Pin Number
QSPI0_CLK PS_MIO6_500 A5
QSPI0_CS PS_MIO1_500 A7
QSPI0_D0 PS_MIO2_500 B8
QSPI0_D1 PS_MIO3_500 D6
QSPI0_D2 PS_MIO4_500 B7
QSPI0_D3 PS_MIO5_500 A6

Table 6.1.2 – QSPI Flash Pin Assignment

6.2 DDR3 DRAM ​

The PI-ZN010-F1-1 development board is equipped with a Samsung 2Gbit (256MB) DDR3 chip, model K4B2G1646F-BYMA. The DDR bus width is 16 bits. The DDR3 SDRAM can operate at up to 533MHz (data rate 1066Mbps). The DDR3 memory system is connected directly to the memory interface of BANK502 in the ZYNQ processing system (PS). The specific DDR3 SDRAM configuration is shown in Table 6.2.1 below.

DesignatorChip TypeCapacityManufacturer
U7 K4B2G1646F-BYMA 128M x 16bit Samsung

Table 6.2.1 – DDR3 SDRAM Configuration

DDR3 hardware design requires strict attention to signal integrity. In both the circuit and PCB design, we have fully considered matching/termination resistors, trace impedance control and trace length matching to ensure the DDR3 operates reliably at high speed. The hardware connection diagram of the DDR3 DRAM is shown in Figure 6.2.1:

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Figure 6.2.1 – DDR3 DRAM Schematic Section

DDR3 DRAM pin assignment:

Signal NameZYNQ Pin NameZYNQ Pin Number
DDR3_DQS0_P PS_DDR_DQS_P0_502 C2
DDR3_DQS0_N PS_DDR_DQS_N0_502 B2
DDR3_DQS1_P PS_DDR_DQS_P1_502 G2
DDR3_DQS1_N PS_DDR_DQS_N1_502 F2
DDR3_DQ[0] PS_DDR_DQ0_502 C3
DDR3_DQ[1] PS_DDR_DQ1_502 B3
DDR3_DQ[2] PS_DDR_DQ2_502 A2
DDR3_DQ[3] PS_DDR_DQ3_502 A4
DDR3_DQ[4] PS_DDR_DQ4_502 D3
DDR3_DQ[5] PS_DDR_DQ5_502 D1
DDR3_DQ[6] PS_DDR_DQ6_502 C1
DDR3_DQ[7] PS_DDR_DQ7_502 E1
DDR3_DQ[8] PS_DDR_DQ8_502 E2
DDR3_DQ[9] PS_DDR_DQ9_502 E3
DDR3_DQ[10] PS_DDR_DQ10_502 G3
DDR3_DQ[11] PS_DDR_DQ11_502 H3
DDR3_DQ[12] PS_DDR_DQ12_502 J3
DDR3_DQ[13] PS_DDR_DQ13_502 H2
DDR3_DQ[14] PS_DDR_DQ14_502 H1
DDR3_DQ[15] PS_DDR_DQ15_502 J1
DDR3_DM0 PS_DDR_DM0_502 A1
DDR3_DM1 PS_DDR_DM1_502 F1
DDR3_A[0] PS_DDR_A0_502 N2
DDR3_A[1] PS_DDR_A1_502 K2
DDR3_A[2] PS_DDR_A2_502 M3
DDR3_A[3] PS_DDR_A3_502 K3
DDR3_A[4] PS_DDR_A4_502 M4
DDR3_A[5] PS_DDR_A5_502 L1
DDR3_A[6] PS_DDR_A6_502 L4
DDR3_A[7] PS_DDR_A7_502 K4
DDR3_A[8] PS_DDR_A8_502 K1
DDR3_A[9] PS_DDR_A9_502 J4
DDR3_A[10] PS_DDR_A10_502 F5
DDR3_A[11] PS_DDR_A11_502 G4
DDR3_A[12] PS_DDR_A12_502 E4
DDR3_A[13] PS_DDR_A13_502 D4
DDR3_A[14] PS_DDR_A14_502 F4
DDR3_BA[0] PS_DDR_BA0_502 L5
DDR3_BA[1] PS_DDR_BA1_502 R4
DDR3_BA[2] PS_DDR_BA2_502 J5
DDR3_S0 PS_DDR_CS_B_502 N1
DDR3_RAS PS_DDR_RAS_B_502 P4
DDR3_CAS PS_DDR_CAS_B_502 P5
DDR3_WE PS_DDR_WE_B_502 M5
DDR3_ODT PS_DDR_ODT_502 N5
DDR3_RESET PS_DDR_DRST_B_502 B4
DDR3_CLK_P PS_DDR_CKP_502 L2
DDR3_CLK_N PS_DDR_CKN_502 M2
DDR3_CKE PS_DDR_CKE_502 N3

Table 6.2.2 – DDR3 DRAM Pin Assignment

6.3 Gigabit Ethernet Interface ​

The PI-ZN010-F1-1 development board provides network communication through the JLSemi JL2121 Ethernet PHY chip. The Ethernet PHY chip is connected to the GPIO interface of BANK501 in the ZYNQ PS. The JL2121 supports 10/100/1000 Mbps data rates and communicates with the MAC layer of the Zynq7000 PS through the RGMII interface. The JL2121 supports MDI/MDIX auto-negotiation, speed auto-negotiation and Master/Slave auto-negotiation, and supports the MDIO bus for PHY register management.

On power-up, the JL2121 detects the level states of certain IO pins to determine its operating mode. Table 6.3.1 describes the default configuration of the GPHY chip after power-on.

Configuration PinDescriptionConfiguration Value
ADR[2:0] MDIO/MDC mode PHY address PHY address is 001
RX Delay RX clock 2ns delay Delayed
TX Delay TX clock 2ns delay Delayed

Table 6.3.1 – PHY Chip Default Configuration

When connected to Gigabit Ethernet, data transfer between the FPGA and the JL2121 PHY chip takes place over the RGMII bus, with a 125MHz transfer clock; data is sampled on both the rising and falling edges of the clock.

When connected to 100M Ethernet, data transfer between the FPGA and the JL2121 PHY chip takes place over the RGMII bus, with a 25MHz transfer clock; data is sampled on both the rising and falling edges of the clock.

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Figure 6.3.1 – FPGA-to-PHY Connection Diagram

The Ethernet pin assignment is as follows:

Signal NameZYNQ Pin NameZYNQ Pin NumberRemark
ETH_TXCK PS_MIO16_501 A19 RGMII transmit clock
ETH_TXD0 PS_MIO17_501 E14 Transmit data bit0
ETH_TXD1 PS_MIO18_501 B18 Transmit data bit1
ETH_TXD2 PS_MIO19_501 D10 Transmit data bit2
ETH_TXD3 PS_MIO20_501 A17 Transmit data bit3
ETH_TXCTL PS_MIO21_501 F14 Transmit enable signal
ETH_RXCK PS_MIO22_501 B17 RGMII receive clock
ETH_RXD0 PS_MIO23_501 D11 Receive data bit0
ETH_RXD1 PS_MIO24_501 A16 Receive data bit1
ETH_RXD2 PS_MIO25_501 F15 Receive data bit2
ETH_RXD3 PS_MIO26_501 A15 Receive data bit3
ETH_RXCTL PS_MIO27_501 D13 Receive data valid signal
ETH_MDC PS_MIO52_501 C10 MDIO management clock
ETH_MDIO PS_MIO53_501 C11 MDIO management data
ETH_RESET PS_MIO49_501 C12 Ethernet reset

Table 6.3.2 – Ethernet Pin Assignment

6.4 USB2.0 ​

The PI-ZN010-F1-1 uses a 1.8V high-speed USB3320C-EZK USB2.0 transceiver that supports the ULPI standard interface. The USB bus interface of the ZYNQ is connected to the USB3320C-EZK transceiver to achieve high-speed USB2.0 data communication in both Host and Slave modes. The USB data and control signals of the USB3320C are connected to the IO pins of BANK501 in the ZYNQ PS, and a 24MHz crystal oscillator provides the system clock for the USB3320C.

The board provides two USB interfaces for users: one Host USB port and one Slave USB port. They are a USB2.0 interface (USB Type A) and a TYPE-C interface, making it convenient to connect different USB peripherals. Users can switch between Host and Slave modes via the J10 jumper on the board. Table 6.4.1 describes the mode switching:

J10 StatusUSB ModeDescription
Jumper installed HOST mode The board acts as the host device; the USB port connects to slave peripherals such as a mouse, keyboard and USB flash drive
No jumper OTG/Slave mode The board acts as a slave device; the USB port connects to a PC

Table 6.4.1 – USB Interface Mode Switching

The connection diagram between the ZYNQ processor and the USB3320C-EZK chip is shown in Figure 6.4.1:

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Figure 6.4.1 – Connection Diagram between Zynq7000 and USB Chip

Figure 6.4.2 shows the physical layout of the USB2.0 section. U14 is the USB3320C, J12 is the Host USB interface and J4 is the Slave USB interface. Jumper J10 is used to select Host or Slave mode.

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Figure 6.4.2 – USB2.0 Interface Photo

The USB2.0 pin assignment is shown in the table below:

Signal NameZYNQ Pin NameZYNQ Pin NumberRemark
OTG_DATA4 PS_MIO28_501 C16 USB data bit4
OTG_DIR PS_MIO29_501 C13 USB data direction signal
OTG_STP PS_MIO30_501 C15 USB stop signal
OTG_NXT PS_MIO31_501 E16 USB next data signal
OTG_DATA0 PS_MIO32_501 A14 USB data bit0
OTG_DATA1 PS_MIO33_501 D15 USB data bit1
OTG_DATA2 PS_MIO34_501 A12 USB data bit2
OTG_DATA3 PS_MIO35_501 F12 USB data bit3
OTG_CLK PS_MIO36_501 A11 USB clock signal
OTG_DATA5 PS_MIO37_501 A10 USB data bit5
OTG_DATA6 PS_MIO38_501 E13 USB data bit6
OTG_DATA7 PS_MIO39_501 C18 USB data bit7
OTG_RESETN PS_MIO1_501 B9 USB reset signal

Table 6.4.2 – USB2.0 Pin Assignment

6.5 USB-to-UART ​

The PI-ZN010-F1-1 development board uses the FTDI FT2232HL USB-to-JTAG and UART chip, with a TYPE-C USB interface. Users can connect to a PC with a TYPE-C cable for serial communication.

The UART TX/RX signals are connected to the signals of BANK501 in the ZYNQ PS. Since the VCCMIO of this bank is set to 1.8V while the data level of the FT2232HL is 3.3V, we use the UM3202V level-shifting chip to connect them. The connection diagram between the FT2232HL and the ZYNQ is shown in Figure 6.5.1:

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Figure 6.5.1 – FT2232HL Connection Diagram

UART pin assignment:

Signal NameZYNQ Pin NameZYNQ Pin NumberRemark
UART_TX PS_MIO47_501 B14 UART data output
UART_RX PS_MIO46_501 D16 UART data input

Table 6.5.1 – UART Pin Assignment

FTDI provides Virtual COM Port (VCP) drivers for the host PC. These drivers allow the FT2232HL USB-UART bridge device to appear as a COM port in communication application software (e.g., TeraTerm or HyperTerminal). The VCP device driver must be installed before the PC host can establish communication with the PI-ZN010-F1-1 development board.

6.6 SD Card Slot ​

The PI-ZN010-F1-1 development board includes a Micro SD card interface, giving users access to SD card storage for storing the ZYNQ chip's BOOT program, Linux operating system kernel, file system and other user data files.

The SDIO signals are connected to the IO signals of BANK501 in the ZYNQ PS. Since the VCCMIO of this bank is set to 1.8V while the SD card data level is 3.3V, we use the TXS02612 level translator to connect them. The schematic of the Zynq7000 PS and the SD card connector is shown in Figure 6.6.1.

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Figure 6.6.1 – SD Card Connection Diagram

SD card slot pin assignment:

Signal NameZYNQ Pin NameZYNQ Pin NumberRemark
SD0_CLK PS_MIO40 D14 SD clock signal
SD0_CMD PS_MIO41 C17 SD command signal
SD0_D0 PS_MIO42 E12 SD data bit0
SD0_D1 PS_MIO43 A9 SD data bit1
SD0_D2 PS_MIO44 F13 SD data bit2
SD0_D3 PS_MIO45 B15 SD data bit3
SD0_CD PS_MIO50 B13 SD card insertion signal

Table 6.6.1 – SD Card Slot Pin Assignment

6.7 WIFI/BT Module ​

The PI-ZN010-F1-1 development board has an onboard WIFI/BT module, model Quectel FCS961K-L, supporting IEEE 802.11b/g/n/ax protocols. The module supports single-band Wi-Fi 2.4GHz and BLE 5.2, with an SDIO 2.0 interface. Users can develop and use it as needed.

WIFI/BT pin assignment:

Signal NameZYNQ Pin NameZYNQ Pin NumberRemark
SD1_D0 PS_MIO10_500 E9 SDIO data bit 0
SD1_D1 PS_MIO13_500 E8 SDIO data bit 1
SD1_D2 PS_MIO14_500 C5 SDIO data bit 2
SD1_D3 PS_MIO15_500 C8 SDIO data bit 3
SD1_CLK PS_MIO12_500 D9 SDIO clock
SD1_CMD PS_MIO11_500 C6 SDIO command
WIFI_CHIP_EN PS_MIO9_500 B5 Module enable
BT_TXD IO_0_35 G14 Bluetooth UART transmit
BT_RXD IO_25_35 J15 Bluetooth UART receive

Table 6.7.1 – WIFI/BT Pin Assignment

6.8 AD Input Interface ​

The PI-ZN010-F1-1 development board is equipped with one AD input interface for acquiring external analog signals and performing AD conversion. An SMA connector is used as the input; the input signal is converted into a differential signal and fed into the ZYNQ. The design diagram of the AD acquisition circuit is shown in Figure 6.8.1 below:

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Figure 6.8.1 – AD Acquisition Circuit Design Diagram

ZYNQ pin assignment of the AD acquisition circuit:

Signal NameZYNQ Pin NameZYNQ Pin NumberRemark
ADC_P VP_0 K9 AD_IN_P
ADC_N VN_0 L10 AD_IN_N

Table 6.8.1 – ZYNQ Pin Assignment of the AD Acquisition Circuit

Chapter 7 PL Peripherals ​

Next, we introduce the peripherals connected to the PL (FPGA logic).

7.1 HDMI Interface ​

HDMI stands for High-Definition Multimedia Interface. On the PI-ZN010-F1-1, the HDMI signals are connected to BANK35 of the ZYNQ PL. The differential signals and clock of the HDMI interface are connected directly through the FPGA's differential IO. Inside the FPGA, the HDMI differential signals are converted to parallel and then encoded/decoded, implementing a digital video output transmission solution with support for up to 1080P@60Hz output.

When the board acts as an HDMI source (HDMI OUT), it must provide +5V power to the HDMI display device. In addition, the HDMI source reads the EDID information of the HDMI display device via the IIC bus. The FPGA pin level is 3.3V, while the HDMI level is +5V, so we need the UM3202V level-shifting chip to connect them. The pin assignment of the HDMI interface is shown in the table below:

Signal NameZYNQ Pin NameZYNQ Pin NumberRemark
HDMI_CLK_P IO_L7P_T1_AD2P_35 M19 HDMI clock signal positive
HDMI_CLK_N IO_L7N_T1_AD2N_35 M20 HDMI clock signal negative
HDMI_D0_P IO_L9P_T1_DQS_AD3P_35 L19 HDMI data 0 positive
HDMI_D0_N IO_L9N_T1_DQS_AD3N_35 L20 HDMI data 0 negative
HDMI_D1_P IO_L18P_T2_AD13P_35 G19 HDMI data 1 positive
HDMI_D1_N IO_L18N_T2_AD13N_35 G20 HDMI data 1 negative
HDMI_D2_P IO_L15P_T2_DQS_AD12P_35 F19 HDMI data 2 positive
HDMI_D2_N IO_L15N_T2_DQS_AD12N_35 F20 HDMI data 2 negative
HDMI_SCL IO_L24N_T3_34 P16 HDMI IIC clock
HDMI_SDA IO_L24P_T3_34 P15 HDMI IIC data

Table 7.1.1 – HDMI Interface Pin Assignment

7.2 LCD Interface ​

The PI-ZN010-F1-1 development board provides an LCD interface for connecting a 4.3-inch display module. The signals are connected to the BANK34 IO pins of the ZYNQ PL. Table 7.2.1 shows the pin assignment of the LCD interface on the BANK34 IO:

Signal NameZYNQ Pin NameZYNQ Pin NumberRemark
LCD_R0 IO_L14P_T2_SRCC_34 N20 Bit 0 of LCD red data channel
LCD_R1 IO_L14N_T2_SRCC_34 P20 Bit 1 of LCD red data channel
LCD_R2 IO_L15P_T2_DQS_34 T20 Bit 2 of LCD red data channel
LCD_R3 IO_L15N_T2_DQS_34 U20 Bit 3 of LCD red data channel
LCD_R4 IO_L16P_T2_34 V20 Bit 4 of LCD red data channel
LCD_R5 IO_L16N_T2_34 W20 Bit 5 of LCD red data channel
LCD_R6 IO_L23N_T3_34 P18 Bit 6 of LCD red data channel
LCD_R7 IO_25_34 T19 Bit 7 of LCD red data channel
LCD_G0 IO_0_34 R19 Bit 0 of LCD green data channel
LCD_G1 IO_L23P_T3_34 N17 Bit 1 of LCD green data channel
LCD_G2 IO_L22N_T3_34 W19 Bit 2 of LCD green data channel
LCD_G3 IO_L13N_T2_MRCC_34 P19 Bit 3 of LCD green data channel
LCD_G4 IO_L22P_T3_34 W18 Bit 4 of LCD green data channel
LCD_G5 IO_L19N_T3_VREF_34 R17 Bit 5 of LCD green data channel
LCD_G6 IO_L9N_T1_DQS_34 U17 Bit 6 of LCD green data channel
LCD_G7 IO_L18N_T2_34 W16 Bit 7 of LCD green data channel
LCD_B0 IO_L18P_T2_34 V16 Bit 0 of LCD blue data channel
LCD_B1 IO_L10N_T1_34 W15 Bit 1 of LCD blue data channel
LCD_B2 IO_L10P_T1_34 V15 Bit 2 of LCD blue data channel
LCD_B3 IO_L9P_T1_DQS_34 T16 Bit 3 of LCD blue data channel
LCD_B4 IO_L3N_T0_DQS_34 V13 Bit 4 of LCD blue data channel
LCD_B5 IO_L4P_T0_34 V12 Bit 5 of LCD blue data channel
LCD_B6 IO_L4N_T0_34 W13 Bit 6 of LCD blue data channel
LCD_B7 IO_L2N_T0_34 U12 Bit 7 of LCD blue data channel
LCD_CLK IO_L2P_T0_34 T12 LCD clock
LCD_HSYNC IO_L6N_T0_VREF_34 R14 LCD horizontal sync
LCD_VSYNC IO_L1P_T0_34 T11 LCD vertical sync
LCD_DE IO_L1N_T0_34 T10 LCD data enable
LCD_BL IO_L5P_T0_34 T14 LCD backlight enable
TP_RST IO_L3P_T0_DQS_PUDC_B_34 U13 LCD touchscreen reset
TP_SDA IO_L11P_T1_SRCC_34 U14 LCD touchscreen I2C data
TP_SCL IO_L5N_T0_34 T15 LCD touchscreen I2C clock
TP_INTR IO_L19P_T2_34 R16 LCD touchscreen interrupt

Table 7.2.1 – LCD Pin Assignment

7.3 MIPI Interface ​

The PI-ZN010-F1-1 development board includes a MIPI camera interface for connecting our MIPI OV5640 camera module. The MIPI interface signals are connected to the BANK34 and BANK35 IO pins of the ZYNQ PL. Figure 7.3.1 shows the MIPI schematic.

image16.png

Figure 7.3.1 – MIPI Interface Schematic

MIPI interface pin assignment:

Signal NameZYNQ Pin NameZYNQ Pin NumberRemark
MIPI_CSI_L0_N IO_L20N_T3_34 R18 LANE0 negative in High Speed mode
LP_MIPI_CSI_L0_N IO_L17N_T2_34 Y19 LANE0 negative in Low Power mode
LP_MIPI_CSI_L0_P IO_L17P_T2_34 Y18 LANE0 positive in Low Power mode
MIPI_CSI_L0_P IO_L20P_T3_34 T17 LANE0 positive in High Speed mode
MIPI_CSI_L1_N IO_L21N_T3_DQS_34 V18 LANE1 negative in High Speed mode
LP_MIPI_CSI_L1_N IO_L7N_T1_34 Y17 LANE1 negative in Low Power mode
LP_MIPI_CSI_L1_P IO_L7P_T1_34 Y16 LANE1 positive in Low Power mode
MIPI_CSI_L1_P IO_L21P_T3_DQS_34 V17 LANE1 positive in High Speed mode
MIPI_CSI_C_N IO_L12N_T1_MRCC_34 U19 Clock negative in High Speed mode
LP_MIPI_CSI_C_N IO_L8N_T1_34 Y14 Clock negative in Low Power mode
LP_MIPI_CSI_C_P IO_L8P_T1_34 W14 Clock positive in Low Power mode
MIPI_CSI_C_P IO_L12P_T1_MRCC_34 U18 Clock positive in High Speed mode
CAM_GPIO IO_L12N_T1_MRCC_35 K18 Camera GPIO control
CAM_CLK IO_L12P_T1_MRCC_35 K17 Camera clock input
CAM_SCL IO_L11N_T1_SRCC_35 L17 Camera I2C clock
CAM_SDA IO_L11P_T1_SRCC_35 L16 Camera I2C data

Table 7.3.1 – MIPI Pin Assignment

7.4 Expansion Connector J11 ​

The J11 expansion connector is a 40-pin, 2.54mm dual-row connector that allows users to expand with more peripherals and interfaces. The modules currently provided by ALINX include: ADDA module, LCD module, Gigabit Ethernet module, audio input/output module, matrix keyboard module and 500W dual-lens vision camera module. The expansion connector provides 1x 5V power, 2x 3.3V power, 3x ground and 34x IO pins. The IO signals are connected to BANK35 of the ZYNQ PL at 3.3V level. On the PCB, the P and N traces of the expansion connector are routed as differential pairs with a controlled differential impedance of 100 ohms. Do not connect 5V devices directly, as this may damage the FPGA. If you need to connect 5V devices, use a level-shifting chip.

J11 expansion connector pin assignment:

J11 PinSignal NameZYNQ Pin NameZYNQ Pin Number
PIN1 GND -- --
PIN2 +5V -- --
PIN3 EX_IO1_1N IO_L6N_T0_VREF_35 F17
PIN4 EX_IO1_1P IO_L6P_T0_35 F16
PIN5 EX_IO1_2N IO_L2N_T0_AD8N_35 A20
PIN6 EX_IO1_2P IO_L2P_T0_AD8P_35 B19
PIN7 EX_IO1_3N IO_L3N_T0_DQS_AD1N_35 D18
PIN8 EX_IO1_3P IO_L3P_T0_DQS_AD1P_35 E17
PIN9 EX_IO1_4N IO_L5N_T0_AD9N_35 E19
PIN10 EX_IO1_4P IO_L5P_T0_AD9P_35 E18
PIN11 EX_IO1_5N IO_L1N_T0_AD0N_35 B20
PIN12 EX_IO1_5P IO_L1P_T0_AD0P_35 C20
PIN13 EX_IO1_6N IO_L17N_T2_AD5N_35 H20
PIN14 EX_IO1_6P IO_L17P_T2_AD5P_35 J20
PIN15 EX_IO1_7N IO_L4N_T0_35 D20
PIN16 EX_IO1_7P IO_L4P_T0_35 D19
PIN17 EX_IO1_8N IO_L10N_T1_AD11N_35 J19
PIN18 EX_IO1_8P IO_L10P_T1_AD11P_35 K19
PIN19 EX_IO1_9N IO_L22N_T3_AD7N_35 L15
PIN20 EX_IO1_9P IO_L22P_T3_AD7P_35 L14
PIN21 EX_IO1_10N IO_L16N_T2_35 G18
PIN22 EX_IO1_10P IO_L16P_T2_35 G17
PIN23 EX_IO1_11N IO_L13N_T2_MRCC_35 H17
PIN24 EX_IO1_11P IO_L13P_T2_MRCC_35 H16
PIN25 EX_IO1_12N IO_L19N_T3_VREF_35 G15
PIN26 EX_IO1_12P IO_L19P_T3_35 H15
PIN27 EX_IO1_13N IO_L14N_T2_AD4N_SRCC_35 H18
PIN28 EX_IO1_13P IO_L14P_T2_AD4P_SRCC_35 J18
PIN29 EX_IO1_14N IO_L20N_T3_AD6N_35 J14
PIN30 EX_IO1_14P IO_L20P_T3_AD6P_35 K14
PIN31 EX_IO1_15N IO_L8N_T1_AD10N_35 M18
PIN32 EX_IO1_15P IO_L8P_T1_AD10P_35 M17
PIN33 EX_IO1_16N IO_L21N_T3_DQS_AD14N_35 N16
PIN34 EX_IO1_16P IO_L21P_T3_DQS_AD14P_35 N15
PIN35 EX_IO1_17N IO_L23N_T3_35 M15
PIN36 EX_IO1_17P IO_L23P_T3_35 M14
PIN37 GND -- --
PIN38 GND -- --
PIN39 +3.3V -- --
PIN40 +3.3V -- --

Table 7.4.1 – J11 Expansion Connector Pin Assignment

7.5 User LED ​

On the PI-ZN010-F1-1 development board, one LED is connected to the BANK35 IO of the PL. Users can use this LED to debug programs. When the BANK35 IO is high, the LED is off; when the BANK35 IO is low, the LED lights up. The connection diagram between the ZYNQ BANK35 IO and the LED is shown in Figure 7.5.1:

image17.png

Figure 7.5.1 – Zynq-7000 to LED Connection Diagram

PS LED pin assignment:

Signal NameZYNQ Pin NameZYNQ Pin NumberRemark
LED1 IO_L24P_T3_AD15P_35 K16 PL LED1

Table 7.5.1 – PL LED Pin Assignment

7.6 User Button ​

On the PI-ZN010-F1-1 development board, one user button is connected to the BANK35 IO of the PL. Users can use this button to test input signals and interrupt triggering. In the design, when the button is pressed, the signal level at the ZYNQ BANK35 IO goes low; when it is not pressed, the signal is high. The connection diagram between the ZYNQ BANK35 IO and the button is shown in Figure 7.6.1:

image18.png

Figure 7.6.1 – Zynq-7000 to Button Connection Diagram

Button pin assignment:

Signal NameZYNQ Pin NameZYNQ Pin NumberRemark
KEY1 IO_L24N_T3_AD15N_35 J16 PL KEY1

Table 7.6.1 – Button Pin Assignment

Appendix: List of Abbreviations ​

AbbreviationFull English NameDescription
PS Processor System The processing subsystem in an SoC, typically including CPU cores, memory controllers, and peripheral interfaces for running software and operating systems.
PL Programmable Logic User-configurable FPGA logic resources used to implement custom digital circuits, interface controllers, and hardware acceleration functions.
SOC System on Chip An integrated circuit that combines processors, memory controllers, peripheral interfaces, and other system functions on a single chip.
DDR3 Double Data Rate 3 SDRAM A third-generation synchronous dynamic memory technology that transfers data on both edges of the clock signal and is commonly used as system memory.
eMMC Embedded Multi Media Card An embedded non-volatile storage device that integrates NAND Flash memory and a storage controller in a single package.
QSPI Quad Serial Peripheral Interface A high-speed serial interface that uses four data lines and is commonly used to connect NOR Flash devices for boot or configuration storage.
GTP Gigabit Transceiver A high-speed serial transceiver integrated in an FPGA for transmitting and receiving data at multi-gigabit rates.
UART Universal Asynchronous Receiver/Transmitter An asynchronous serial communication interface that transmits and receives data through TX and RX signal lines.
HDMI High-Definition Multimedia Interface A digital multimedia interface used to transmit high-definition video and audio signals between source and display devices.
PCIe Peripheral Component Interconnect Express A high-speed serial expansion bus standard used for communication between processors and devices such as FPGAs, GPUs, and SSDs.
USB Universal Serial Bus A standard serial interface used for data communication, peripheral connection, and power delivery between electronic devices.
JTAG Joint Test Action Group A standardized interface used for device testing, boundary scan, FPGA programming, and processor or system debugging.
SFP Small Form-factor Pluggable A compact, hot-pluggable transceiver interface used for optical or electrical network communication.
MIO Multiplexed I/O Multiplexed processor I/O pins in an SoC that can be configured for functions such as UART, I2C, SPI, or GPIO.
GPHY Gigabit Ethernet PHY A Gigabit Ethernet physical-layer transceiver that converts digital Ethernet data into electrical signals for transmission over a physical network medium.
I2C Inter-Integrated Circuit A two-wire serial communication bus using SDA and SCL lines, commonly used to connect sensors, EEPROMs, and peripheral devices.
RGMII Reduced Gigabit Media Independent Interface A reduced-pin-count interface between an Ethernet MAC and PHY that supports 10, 100, and 1000 Mbps Ethernet communication.
RMII Reduced Media Independent Interface A reduced-pin-count interface between an Ethernet MAC and PHY, mainly used for 10 and 100 Mbps Ethernet communication.
LED Light Emitting Diode A semiconductor device that emits light when electrically driven and is commonly used for power, status, and fault indication.
LVDS Low-Voltage Differential Signaling A high-speed differential signaling standard that provides low power consumption, low noise, and strong resistance to electromagnetic interference.

Contact information ​

Alinx Electronic Limited

Company Website: www.en.alinx.com

Service Hotline: +86 21 67676997

Technical Support:technical@alinx.com